Assignee
EDELSTEIN DANIEL C
US·17 granted patents·3 pending applications·246 citations·filing 2007–2012
Top patents by PatentIndex Score
20 records- 0198US8525169B1Reliable physical unclonable function for device authenticationEDELSTEIN DANIEL C·Filed 2012·Granted Sep 3, 2013·115 cites·23 claims
- 0296US8288268B2Microelectronic structure including air gapEDELSTEIN DANIEL C·Filed 2010·Granted Oct 16, 2012·24 cites·20 claims
- 0394US8759976B2Structure with sub-lithographic random conductors as a physical unclonable functionEDELSTEIN DANIEL C·Filed 2012·Granted Jun 24, 2014·18 cites·19 claims
- 0494US8497202B1Interconnect structures and methods of manufacturing of interconnect structuresEDELSTEIN DANIEL C·Filed 2012·Granted Jul 30, 2013·14 cites·16 claims
- 0593US9105693B2Microelectronic structure including air gapEDELSTEIN DANIEL C·Filed 2012·Granted Aug 11, 2015·11 cites·8 claims
- 0693US8461678B2Structure with self aligned resist layer on an interconnect surface and method of making sameEDELSTEIN DANIEL C·Filed 2012·Granted Jun 11, 2013·11 cites·18 claims
- 0791US8129286B2Reducing effective dielectric constant in semiconductor devicesEDELSTEIN DANIEL C·Filed 2008·Granted Mar 6, 2012·11 cites·32 claims
- 0889US8101236B2Method of fabricating a SiCOH dielectric material with improved toughness and improved Si-C bondingEDELSTEIN DANIEL C·Filed 2009·Granted Jan 24, 2012·8 cites·24 claims
- 0987US8492289B2Barrier layer formation for metal interconnects through enhanced impurity diffusionEDELSTEIN DANIEL C·Filed 2010·Granted Jul 23, 2013·9 cites·4 claims
- 1086US8969197B2Copper interconnect structure and its formationEDELSTEIN DANIEL C·Filed 2012·Granted Mar 3, 2015·7 cites·7 claims
- 1184US8227336B2Structure with self aligned resist layer on an interconnect surface and method of making sameEDELSTEIN DANIEL C·Filed 2009·Granted Jul 24, 2012·6 cites·23 claims
- 1274US8772942B2Interconnect structure employing a Mn-group VIIIB alloy linerEDELSTEIN DANIEL C·Filed 2010·Granted Jul 8, 2014·3 cites·15 claims
- 1373US9070686B2Wiring switch designs based on a field effect device for reconfigurable interconnect pathsEDELSTEIN DANIEL C·Filed 2012·Granted Jun 30, 2015·3 cites·20 claims
- 1473US9059251B2Microelectronic structure including air gapEDELSTEIN DANIEL C·Filed 2012·Granted Jun 16, 2015·2 cites·15 claims
- 1564US8294270B2Copper alloy via bottom linerEDELSTEIN DANIEL C·Filed 2011·Granted Oct 23, 2012·1 cites·12 claims
- 1664US8120143B2Integrated circuit comb capacitorEDELSTEIN DANIEL C·Filed 2008·Granted Feb 21, 2012·2 cites·10 claims
- 1763US8658533B2Semiconductor interconnect structure with multi-layered seed layer providing enhanced reliability and minimizing electromigrationEDELSTEIN DANIEL C·Filed 2011·Granted Feb 25, 2014·1 cites·6 claims
- 1852US2008020230A1Copper Alloy Via Bottom LinerEDELSTEIN DANIEL C·Filed 2007·Application pending·0 cites
- 1949US2013307153A1Interconnect with titanium-oxide diffusion barrierEDELSTEIN DANIEL C·Filed 2012·Application pending·0 cites
- 2041US2014042627A1Electronic structure containing a via array as a physical unclonable functionEDELSTEIN DANIEL C·Filed 2012·Application pending·0 cites
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