Assignee
FURMAN BRUCE K
US·3 granted patents·2 pending applications·21 citations·filing 2005–2011
Top patents by PatentIndex Score
5 records- 0191US8156998B2Patterned metal thermal interfaceFURMAN BRUCE K·Filed 2010·Granted Apr 17, 2012·12 cites·18 claims
- 0288US8541291B2Thermo-compression bonded electrical interconnect structure and methodFURMAN BRUCE K·Filed 2011·Granted Sep 24, 2013·8 cites·20 claims
- 0367US8164192B2Thermo-compression bonded electrical interconnect structureFURMAN BRUCE K·Filed 2011·Granted Apr 24, 2012·1 cites·17 claims
- 0448US2008277778A1Layer Transfer Process and Functionally Enhanced Integrated Circuits Products TherebyFURMAN BRUCE K·Filed 2007·Application pending·0 cites
- 0540US2006131738A1Method and apparatus for chip cooling using a liquid metal thermal interfaceFURMAN BRUCE K·Filed 2005·Application pending·0 cites
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