Assignee
FURUSAWA TAKESHI
JP·3 granted patents·2 pending applications·7 citations·filing 2008–2012
Top patents by PatentIndex Score
5 records- 0176US8203210B2Semiconductor device having metal contacts formed in an interlayer dielectric film comprising four silicon-containing layersFURUSAWA TAKESHI·Filed 2010·Granted Jun 19, 2012·4 cites·25 claims
- 0275US8963291B2Semiconductor chip with seal ring and sacrificial corner patternFURUSAWA TAKESHI·Filed 2011·Granted Feb 24, 2015·3 cites·8 claims
- 0348US2008230847A1Semiconductor device and manufacturing method of the sameFURUSAWA TAKESHI·Filed 2008·Application pending·0 cites
- 0447US8097948B2Semiconductor device and manufacturing method of semiconductor deviceFURUSAWA TAKESHI·Filed 2010·Granted Jan 17, 2012·0 cites·15 claims
- 0547US2012289032A1Semiconductor device and manufacturing method of the sameFURUSAWA TAKESHI·Filed 2012·Application pending·0 cites
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