Assignee
GREAT TEAM BACKEND FOUNDRY INC
VG·1 granted patent·6 pending applications·4 citations·filing 2009–2010
Technology mixH10W7
Top patents by PatentIndex Score
7 records- 0166US7859123B2Wire bonding structure and manufacturing method thereofGREAT TEAM BACKEND FOUNDRY INC·Filed 2009·Granted Dec 28, 2010·4 cites·5 claims
- 0246US2010102429A1Flip-chip package structure with block bumps and the wedge bonding method thereofGREAT TEAM BACKEND FOUNDRY INC·Filed 2009·Application pending·0 cites
- 0341US2010123243A1Flip-chip chip-scale package structureGREAT TEAM BACKEND FOUNDRY INC·Filed 2009·Application pending·0 cites
- 0440US2011031302A1Flip-chip package structure with block bumps and the wedge bonding method thereofGREAT TEAM BACKEND FOUNDRY INC·Filed 2010·Application pending·0 cites
- 0532US2011049692A1Connection device bewteen transistor and lead frameGREAT TEAM BACKEND FOUNDRY INC·Filed 2010·Application pending·0 cites
- 0632US2011127658A1Muti Thickness Lead FrameGREAT TEAM BACKEND FOUNDRY INC·Filed 2010·Application pending·0 cites
- 0725US2010295180A1Wire bonding structure and manufacturing method thereofGREAT TEAM BACKEND FOUNDRY INC·Filed 2010·Application pending·0 cites
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