Wire bonding structure and manufacturing method thereof

Abstract

The present invention relates to a wire bonding structure, and more particularly to a manufacturing method for said wire bonding structure. The wire bonding structure comprises a die that connects with a lead via a bonding wire. At least one bond pad is positioned on an active surface of the die, and a gold bump is provided on the bond pad; furthermore, a ball bond can be positioned upon the gold bump. The bond pad and the gold bump can separate the ball bond and the die, which can avoid damaging the die during the bonding process.

1 . A wire bonding structure, comprising:
 a die comprising a first surface and a second surface;   a bond pad positioned on said first surface of said die;   a bump positioned on said bond pad, wherein said bump comprises gold;   a ball bond positioned upon said bump; and   a bonding wire connecting with said ball bond and a lead.   
     
     
         2 . The wire bonding structure of  claim 1 , comprising a substrate positioned under said second surface of said die. 
     
     
         3 . The wire bonding structure of  claim 1 , wherein the material of said ball bond and said bonding wire is the same. 
     
     
         4 . The wire bonding structure of  claim 3 , wherein the material of said ball bond and said bonding wire is copper, tin, or aluminum. 
     
     
         5 . The wire bonding structure of  claim 1 , wherein a capillary is used to form said ball bond and said bonding wire. 
     
     
         6 . The wire bonding structure of  claim 1 , wherein said first surface of said die is an active surface. 
     
     
         7 . A manufacturing method of a wire bonding structure including a bond pad positioned on a die, comprising the steps of:
 forming a bump on said bond pad, wherein said bump comprises gold;   forming a ball bond on said bump; and   forming a bonding wire to connect said ball bond and a lead.   
     
     
         8 . The manufacturing method of  claim 7 , comprising the step of:
 using a capillary to form said ball bond and said bonding wire.   
     
     
         9 . The manufacturing method of  claim 7 , wherein said ball bond and said bonding wire comprise copper, tin or aluminum. 
     
     
         10 . The manufacturing method of  claim 7 , wherein said bump is formed by plating technology. 
     
     
         11 . The manufacturing method of  claim 7 , wherein said bump is formed by a capillary with metal diffusion technology. 
     
     
         12 . A wire bonding structure, comprising:
 a substrate;   a lead positioned on said substrate;   a die positioned on said substrate, wherein said die comprises a first surface and a second surface;   a bond pad positioned on said first surface of said die;   a bump positioned on said bond pad, wherein said bump comprises gold;   a ball bond positioned upon said bump; and   a bonding wire electrically connecting with said lead and said ball bond.   
     
     
         13 . The wire bonding structure of  claim 12 , comprising an adhesive layer positioned between said substrate and said die.