Assignee
HASEBE AKIO
JP·2 granted patents·1 pending application·3 citations·filing 2007–2010
Top patents by PatentIndex Score
3 records- 0164US8062911B2Method of manufacturing a semiconductor integrated circuit device and a method of manufacturing a thin film probe sheet for using the sameHASEBE AKIO·Filed 2007·Granted Nov 22, 2011·2 cites·9 claims
- 0261US8206997B2Method of manufacturing a semiconductor integrated circuit device and a method of manufacturing a thin film probe sheet for using the sameHASEBE AKIO·Filed 2010·Granted Jun 26, 2012·1 cites·14 claims
- 0345US2007207559A1Fabrication method of semiconductor integrated circuit deviceHASEBE AKIO·Filed 2007·Application pending·0 cites
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