Assignee
HITACHI CHEM DUPONT MICROSYS
US·18 granted patents·2 pending applications·207 citations·filing 1999–2012
Top patents by PatentIndex Score
20 records- 0191US7435525B2Positive photosensitive resin composition, method for forming pattern, and electronic partHITACHI CHEM DUPONT MICROSYS·Filed 2005·Granted Oct 14, 2008·22 cites·8 claims
- 0277US7642018B2Photosensitive resin composition, pattern forming method and electronic parts using the photosensitive resin compositionHITACHI CHEM DUPONT MICROSYS·Filed 2007·Granted Jan 5, 2010·6 cites·7 claims
- 0375US7638254B2Positive photosensitive resin composition, method for forming pattern, and electronic partHITACHI CHEM DUPONT MICROSYS·Filed 2008·Granted Dec 29, 2009·4 cites·10 claims
- 0475US6232032B1Photosensitive polymer composition, method for forming relief patterns, and electronic partsHITACHI CHEM DUPONT MICROSYS·Filed 1999·Granted May 15, 2001·31 cites·11 claims
- 0574US7851128B2Photosensitive polymer composition, method of forming relief patterns, and electronic equipmentHITACHI CHEM DUPONT MICROSYS·Filed 2006·Granted Dec 14, 2010·3 cites·9 claims
- 0674US6436593B1Positive photosensitive resin composition, process for producing pattern and electronic partsHITACHI CHEM DUPONT MICROSYS·Filed 2000·Granted Aug 20, 2002·33 cites·13 claims
- 0771US6960420B2Photosensitive resin composition, process for forming relief pattern, and electronic componentHITACHI CHEM DUPONT MICROSYS·Filed 2003·Granted Nov 1, 2005·10 cites·16 claims
- 0866US6514658B2Photosensitive polymer composition, method for forming relief patterns, and electronic partsHITACHI CHEM DUPONT MICROSYS·Filed 2001·Granted Feb 4, 2003·8 cites·34 claims
- 0964US6329494B1Photosensitive resin compositionHITACHI CHEM DUPONT MICROSYS·Filed 1999·Granted Dec 11, 2001·15 cites·34 claims
- 1063US7932012B2Heat-resistant photosensitive resin composition, method for forming pattern using the composition, and electronic partHITACHI CHEM DUPONT MICROSYS·Filed 2004·Granted Apr 26, 2011·10 cites·13 claims
- 1163US6600053B2Method of preparing photosensitive resin compositionHITACHI CHEM DUPONT MICROSYS·Filed 2001·Granted Jul 29, 2003·6 cites·2 claims
- 1258US7150947B2Photosensitive polymer composition, method of forming relief patterns, and electronic equipmentHITACHI CHEM DUPONT MICROSYS·Filed 2003·Granted Dec 19, 2006·12 cites·14 claims
- 1358US6329110B1Photosensitive polymer composition, method for forming relief patterns, and electronic partsHITACHI CHEM DUPONT MICROSYS·Filed 1999·Granted Dec 11, 2001·16 cites·21 claims
- 1453US6365306B2Photosensitive polymer composition, method for forming relief patterns, and electronic partsHITACHI CHEM DUPONT MICROSYS·Filed 2001·Granted Apr 2, 2002·3 cites·10 claims
- 1552US6340546B1Positive photosensitive resin composition, method of forming relief pattern, and electronic partHITACHI CHEM DUPONT MICROSYS·Filed 2000·Granted Jan 22, 2002·3 cites·14 claims
- 1650US6342333B1Photosensitive resin composition, patterning method, and electronic componentsHITACHI CHEM DUPONT MICROSYS·Filed 1999·Granted Jan 29, 2002·9 cites·22 claims
- 1749US6146815ADeveloper for photosensitive polyimide precursor, and method of using it for patterningHITACHI CHEM DUPONT MICROSYS·Filed 1999·Granted Nov 14, 2000·14 cites·8 claims
- 1847US6773866B2Photosensitive resin composition, patterning method, and electronic componentsHITACHI CHEM DUPONT MICROSYS·Filed 2001·Granted Aug 10, 2004·2 cites·5 claims
- 1942US2010159217A1Negative-type photosensitive resin composition, method for forming patterns, and electronic partsHITACHI CHEM DUPONT MICROSYS·Filed 2006·Application pending·0 cites
- 2042US2013143011A1Photosensitive resin compositionHITACHI CHEM DUPONT MICROSYS·Filed 2012·Application pending·0 cites
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