Heat-resistant photosensitive resin composition, method for forming pattern using the composition, and electronic part

Abstract

A heat resistant photosensitive resin composition having excellent film properties is provided by constituting a photosensitive resin composition containing (A) a polymer having an acid functional group and/or a substituent derived therefrom, (B) a compound having at least one substituent derived from an amine functional group, (C) a photoreactive compound, and (D) a solvent. Using this composition, a pattern with high resolution can be produced, and thus an electronic part having a high quality can be produced.

1. A photosensitive resin composition comprising:
 (A) a polymer having an acid functional group and/or a substituent derived therefrom; 
 (B) a compound represented by the general formula (10):
   X—(NR 4 R 5 ) n   (10)
 
 
 
       wherein X represents an n-valent organic group, n represents an integer of 2 to 6, and each of R 4  and R 5  represents hydrogen or a monovalent organic group, at least one of R 4  and R 5  is selected from the group consisting of: 
       
         
           
           
               
               
           
         
       
       wherein R 3  represents a monovalent organic group; X 3  represents an oxygen, sulfur, or nitrogen atom; and n represents 1 when X 3  is an oxygen atom or a sulfur atom, or n represents 2 when X 3  is a nitrogen atom;
 (C) a photoreactive compound; and 
 (D) a solvent, 
 wherein said polymer (A) is a heat-resistant polymer, and 
 wherein the heat-resistant polymer is a polyimide precursor represented by the general formula (1) below or polyimide derived from the precursor, a polybenzoxazole precursor represented by the general formula (2) below or polybenzoxazole derived from the precursor, a copolymer thereof, or a mixture thereof: 
 
       
         
           
           
               
               
           
         
       
       wherein X 1  represents a tetravalent organic group, Y 1  represents a divalent organic group, R 1  represents hydrogen or a monovalent organic group, and n 1  represents an integer of 2 to 500 corresponding to the number of the repeating units of the polymer, 
       
         
           
           
               
               
           
         
       
       wherein X 2  represents a divalent organic group, Y 2  represents a tetravalent organic group, of which two valences are used in bonding to hydroxyl groups, R 2  represents hydrogen or a monovalent organic group, and n 2  represents an integer of 2 to 500 corresponding to the number of the repeating units of the polymer. 
     
     
       2. The photosensitive resin composition according to  claim 1 , wherein the compound of the component (B) further has at least one acid functional group and/or substituent derived therefrom. 
     
     
       3. The photosensitive resin composition according to  claim 1 , wherein the component (B) further has at least one acid functional group and/or substituent derived therefrom. 
     
     
       4. The photosensitive resin composition according to  claim 3 , wherein the component (B) has one substituent or two substituents derived from an amine functional group and has one acid functional group and/or substituent derived therefrom. 
     
     
       5. The photosensitive resin composition according to  claim 1 , wherein the acid functional group in the polymer (A) is a carboxyl group and/or a phenolic hydroxyl group. 
     
     
       6. A method for forming a pattern, comprising:
 a step of applying the photosensitive resin composition according to  claim 1  onto a substrate and drying it; 
 a step of subjecting the applied and dried photosensitive resin film to light exposure; 
 a step of subjecting the exposed photosensitive resin film to development using an alkaline aqueous solution; and 
 a step of subjecting the pattern obtained in the development to heat treatment. 
 
     
     
       7. An electronic part having an electronic device having the pattern obtained by the method according to  claim 6 , wherein the pattern is an interlayer dielectric layer and/or a surface protecting film layer. 
     
     
       8. The photosensitive resin composition according to  claim 1 , wherein said R 3  is a monovalent organic group having 1 to 20 carbon atoms. 
     
     
       9. The photosensitive resin composition according to  claim 1 , wherein said compound of the component (B) serves as a chain extender capable of increasing molecular weight of said polymer of the component (A) during a heat treatment of the photosensitive resin composition. 
     
     
       10. The photosensitive resin composition according to  claim 1 , which contains 0.05 to 50 parts by weight of said compound of the component (B) relative to 100 parts by weight of said polymer of the component (A). 
     
     
       11. The photosensitive resin composition according to  claim 1 , which contains 0.2 to 20 parts by weight of said compound of the component (B) relative to 100 parts by weight of said polymer of the component (A). 
     
     
       12. The photosensitive resin composition according to  claim 1 , wherein said polymer (A) has an acid functional group. 
     
     
       13. The photosensitive resin composition according to  claim 1 , wherein R 3  is selected from the group consisting of methyl, ethyl, propyl, isopropyl, n-butyl, s-butyl, t-butyl, cyclopropenyl, cyclobutyl, cyclopentyl, cyclohexyl, cyclohexylmethyl, cyclohexenyl, norbornyl, norbornenyl, adamantyl, benzyl, p-nitrobenzyl, trifluoromethyl, methoxymethyl, ethoxyethyl, methoxymethyl, ethoxymethyl, methoxyethoxymethyl, benzoxymethyl, ethoxytetrahydropyranyl, tetrahydrofuranyl, 2-trimethylsilylethoxymethyl, trimethylsilyl, t-butyldimethylsilyl, 3-oxocyclohexyl, 9-fluorenylmethyl, methylthiomethyl, phenyl, toluyl, xylyl, 9,10-dihydroanthranyl, trimethylphenyl, pentamethylphenyl, biphenyl, terphenyl, quterphenyl, dimethylbiphenyl, naphthalenyl, methylnaphthalenyl, fluorenyl, fluorophenyl, fluorobiphenyl, isopropylidenebiphenyl, tetrafluoroisopropylidenebiphenyl, benzyl phenyl ether, phenyl ether, phenoxytoluoyl, methoxybiphenyl, dimethoxybiphenyl, methoxynaphthalenyl, dimethoxynaphthalenyl, and nitrophenyl.