Assignee
HUANG PING
TW·8 granted patents·9 pending applications·86 citations·filing 2005–2025
Top patents by PatentIndex Score
17 records- 0196US8702479B2Polishing pad with multi-modal distribution of pore diametersHUANG PING·Filed 2010·Granted Apr 22, 2014·30 cites·42 claims
- 0283US8486803B2Wafer level packaging method of encapsulating the bottom and side of a semiconductor chipHUANG PING·Filed 2011·Granted Jul 16, 2013·8 cites·7 claims
- 0380US8747526B2Vertical type air humidifying and purifying machineHUANG PING·Filed 2012·Granted Jun 10, 2014·8 cites·8 claims
- 0474USD664248SVertically-oriented air purifying and humidifying apparatusHUANG PING·Filed 2012·Granted Jul 24, 2012·22 cites·1 claims
- 0574US2026034434A1Game wheelHUANG PING·Filed 2025·Application pending·0 cites
- 0661USD681795SFanHUANG PING·Filed 2012·Granted May 7, 2013·12 cites·1 claims
- 0759US8307094B2Method for processing register request, network element, and communication systemHUANG PING·Filed 2007·Granted Nov 6, 2012·2 cites·10 claims
- 0856US2011101128A1Mist FanHUANG PING·Filed 2009·Application pending·0 cites
- 0951US2008246169A1Filtering structure of a humidifierHUANG PING·Filed 2007·Application pending·0 cites
- 1048US2007176306A1Safety device for a humidifierHUANG PING·Filed 2006·Application pending·0 cites
- 1148US2007152356A1Humidifier structureHUANG PING·Filed 2005·Application pending·0 cites
- 1246US2008245892A1Decay prevention structure of a heat dissipating board of a humidifierHUANG PING·Filed 2007·Application pending·0 cites
- 1343US2010327314A1Insulated Gate Bipolar Transistor (IGBT) Collector Formed with Ge/A1 and Production MethodHUANG PING·Filed 2009·Application pending·0 cites
- 1440USD650474SAir purifierHUANG PING·Filed 2011·Granted Dec 13, 2011·4 cites·1 claims
- 1535USD1105634S2-tier cat play tentHUANG PING·Filed 2025·Granted Dec 9, 2025·0 cites·1 claims
- 1634US2012142165A1Method of Avoiding Resin Outflow from the Wafer Scribe line in WLCSPHUANG PING·Filed 2011·Application pending·0 cites
- 1732US2011294262A1Semiconductor package process with improved die attach method for ultrathin chipsHUANG PING·Filed 2010·Application pending·0 cites
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