Assignee
HUANG RUI
CN·23 granted patents·5 pending applications·159 citations·filing 2008–2023
Top patents by PatentIndex Score
28 records- 0198US9524955B2Semiconductor device and method of forming no-flow underfill material around vertical interconnect structureHUANG RUI·Filed 2012·Granted Dec 20, 2016·49 cites·5 claims
- 0295US8476120B2Semiconductor device and method of forming three-dimensional vertically oriented integrated capacitorsHUANG RUI·Filed 2012·Granted Jul 2, 2013·16 cites·35 claims
- 0393USD995939SBird feederHUANG RUI·Filed 2023·Granted Aug 15, 2023·16 cites·1 claims
- 0492US8269320B2Integrated circuit package system for electromagnetic isolation and method for manufacturing thereofHUANG RUI·Filed 2011·Granted Sep 18, 2012·12 cites·18 claims
- 0587US8405228B2Integrated circuit packaging system with package underfill and method of manufacture thereofHUANG RUI·Filed 2009·Granted Mar 26, 2013·13 cites·9 claims
- 0686US8163597B2Semiconductor device and method of forming no-flow underfill material around vertical interconnect structureHUANG RUI·Filed 2009·Granted Apr 24, 2012·12 cites·31 claims
- 0785US8399305B2Semiconductor device and method of forming dam material with openings around semiconductor die for mold underfill using dispenser and vacuum assistHUANG RUI·Filed 2010·Granted Mar 19, 2013·11 cites·28 claims
- 0885US8159047B2Semiconductor device and method of forming three-dimensional vertically oriented integrated capacitorsHUANG RUI·Filed 2011·Granted Apr 17, 2012·6 cites·23 claims
- 0982US8299596B2Integrated circuit packaging system with bump conductors and method of manufacture thereofHUANG RUI·Filed 2010·Granted Oct 30, 2012·6 cites·20 claims
- 1079US9123733B1Integrated circuit packaging system with package underfill and method of manufacture thereofHUANG RUI·Filed 2013·Granted Sep 1, 2015·4 cites·19 claims
- 1178US9131480B2Techniques to manage group controling signaling for machine-to-machine devicesHUANG RUI·Filed 2012·Granted Sep 8, 2015·4 cites·11 claims
- 1270US9257356B2Semiconductor device and method of forming an IPD beneath a semiconductor die with direct connection to external devicesHUANG RUI·Filed 2008·Granted Feb 9, 2016·4 cites·39 claims
- 1367US8288844B2Integrated circuit packaging system with package stacking and method of manufacture thereofHUANG RUI·Filed 2009·Granted Oct 16, 2012·3 cites·20 claims
- 1464US11202178B2Techniques for machine-to-machine device managementHUANG RUI·Filed 2011·Granted Dec 14, 2021·1 cites·13 claims
- 1562USD1081013SAutomatic pet feederHUANG RUI·Filed 2022·Granted Jun 24, 2025·2 cites·1 claims
- 1656US8717967B2Determining channel configurationsHUANG RUI·Filed 2011·Granted May 6, 2014·0 cites·29 claims
- 1754US2024085982A1Haptic-feedback bilateral human-machine interaction method based on remote digital interactionHUANG RUI·Filed 2023·Application pending·0 cites
- 1854US2023418384A1Wearable device with haptic feedback and stimulations for the physicalization of remote digital interactionHUANG RUI·Filed 2023·Application pending·0 cites
- 1953US8803330B2Integrated circuit package system with mounting structureHUANG RUI·Filed 2008·Granted Aug 12, 2014·0 cites·10 claims
- 2053US8325833B2Interlaced symbol constellation mapping for wireless communicationHUANG RUI·Filed 2009·Granted Dec 4, 2012·0 cites·20 claims
- 2152US9525960B2System and method for improving network access in machine to machine communicationHUANG RUI·Filed 2011·Granted Dec 20, 2016·0 cites·19 claims
- 2252US9451386B2Resource scheduling for machine-to-machine devicesHUANG RUI·Filed 2011·Granted Sep 20, 2016·0 cites·10 claims
- 2352US2014335655A1Integrated circuit package system with mounting structureHUANG RUI·Filed 2014·Application pending·0 cites
- 2451US9094854B2Reducing power consumption for M2M communications in wireless networksHUANG RUI·Filed 2011·Granted Jul 28, 2015·0 cites·8 claims
- 2543US9236278B2Integrated circuit packaging system with a substrate embedded dummy-die paddle and method of manufacture thereofHUANG RUI·Filed 2011·Granted Jan 12, 2016·0 cites·20 claims
- 2640US2014198738A1Techniques to manage paging cycles for machine-to-machine devicesHUANG RUI·Filed 2012·Application pending·0 cites
- 2738US2011309481A1Integrated circuit packaging system with flip chip mounting and method of manufacture thereofHUANG RUI·Filed 2010·Application pending·0 cites
- 2836USD1080086SPet water dispenserHUANG RUI·Filed 2022·Granted Jun 17, 2025·0 cites·1 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →