Integrated circuit package system with mounting structure

Abstract

An integrated circuit package system includes: providing a mountable structure having a contact pad and an inner pad; mounting an integrated circuit device having a linear through channel over the mountable structure with the linear through channel traversing between an integrated circuit device first side and an integrated circuit device second side; and connecting the linear through channel exposed on the integrated circuit device second side to the inner pad.

What is claimed is: 
     
         1 . An integrated circuit package system comprising:
 providing a mountable structure having a contact pad and an inner pad;   mounting an integrated circuit device having a linear through channel over the mountable structure with the linear through channel traversing between an integrated circuit device first side and an integrated circuit device second side; and   connecting the linear through channel exposed on the integrated circuit device second side to the inner pad.   
     
     
         2 . The system as claimed in  claim 1  wherein providing the mountable structure includes providing an insulation layer or a semiconductor die 
     
     
         3 . The system as claimed in  claim 1  further comprising forming the integrated circuit device includes:
 providing a first integrated circuit; and 
 mounting a second integrated circuit over the first integrated circuit. 
 
     
     
         4 . The system as claimed in  claim 1  further comprising:
 mounting the mountable structure over a carrier; and 
 connecting the contact pad and the carrier; and 
 encapsulating the carrier and the mountable structure with the linear through channel exposed. 
 
     
     
         5 . The system as claimed in  claim 1  further comprising forming an encapsulation over the mountable structure with the linear through channel exposed and with the encapsulation planar with the integrated circuit device first side. 
     
     
         6 . An integrated circuit package system comprising:
 providing a mountable structure having a contact pad and an inner pad;   mounting an integrated circuit device having a linear through channel over the mountable structure with the contact pad exposed and with the linear through channel traversing between an integrated circuit device first side and an integrated circuit device second side; and   connecting a mounting interconnect between the linear through channel exposed on the integrated circuit device second side and the inner pad.   
     
     
         7 . The system as claimed in  claim 6  further comprising forming an underfill around the mounting interconnect. 
     
     
         8 . The system as claimed in  claim 6  wherein providing the mountable structure includes providing the mountable structure having the protective layer with the contact pad exposed from the protective layer. 
     
     
         9 . The system as claimed in  claim 6  wherein mounting the integrated circuit device having the linear through channel over the mountable structure includes mounting the integrated circuit device over the inner pad. 
     
     
         10 . The system as claimed in  claim 6  further comprising:
 mounting a packaged module over a carrier; 
 mounting the mountable structure over the packaged module; 
 connecting the contact pad and the carrier; and 
 encapsulating the carrier, the packaged module, the mountable structure, and the integrated circuit device with the linear through channel exposed; and 
 mounting a device over the linear through channel.