Assignee
IMANAKA YOSHIHIKO
JP·5 granted patents·2 pending applications·25 citations·filing 2005–2014
Top patents by PatentIndex Score
7 records- 0177US8080875B2Interconnection substrate and semiconductor device, manufacturing method of interconnection substrateIMANAKA YOSHIHIKO·Filed 2008·Granted Dec 20, 2011·6 cites·9 claims
- 0276US8213159B2Electrode foil, method of manufacturing electrode foil, and electrolytic capacitorIMANAKA YOSHIHIKO·Filed 2009·Granted Jul 3, 2012·7 cites·20 claims
- 0371US8278217B2Semiconductor device and method of producing the sameIMANAKA YOSHIHIKO·Filed 2005·Granted Oct 2, 2012·5 cites·18 claims
- 0470US2015143679A1Method for manufacturing capacitor, and capacitorIMANAKA YOSHIHIKO·Filed 2014·Application pending·0 cites
- 0568US8404134B2Method for manufacturing electrode foilIMANAKA YOSHIHIKO·Filed 2009·Granted Mar 26, 2013·5 cites·15 claims
- 0662US8957499B2Laminate stacked capacitor, circuit substrate with laminate stacked capacitor and semiconductor apparatus with laminate stacked capacitorIMANAKA YOSHIHIKO·Filed 2011·Granted Feb 17, 2015·2 cites·8 claims
- 0753US2012300371A1Electrode foil, method of manufacturing electrode foil, and electrolytic capacitorIMANAKA YOSHIHIKO·Filed 2012·Application pending·0 cites
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