Assignee
ITOKAWA HIROSHI
US·1 granted patent·8 pending applications·17 citations·filing 2005–2012
Top patents by PatentIndex Score
9 records- 0189US8729607B2Needle-shaped profile finFET deviceITOKAWA HIROSHI·Filed 2012·Granted May 20, 2014·17 cites·18 claims
- 0245US2008160642A1Semiconductor deviceITOKAWA HIROSHI·Filed 2008·Application pending·0 cites
- 0345US2010029053A1Method of manufacturing semiconductor deviceITOKAWA HIROSHI·Filed 2009·Application pending·0 cites
- 0444US2009108412A1Semiconductor substrate and method for manufacturing a semiconductor substrateITOKAWA HIROSHI·Filed 2008·Application pending·0 cites
- 0543US2010006907A1Semiconductor device and method of manufacturing the sameITOKAWA HIROSHI·Filed 2009·Application pending·0 cites
- 0641US2010084685A1Semiconductor device and manufacturing method thereofITOKAWA HIROSHI·Filed 2009·Application pending·0 cites
- 0740US2006214210A1Semiconductor deviceITOKAWA HIROSHI·Filed 2005·Application pending·0 cites
- 0834US2011014781A1Method of fabricating semiconductor deviceITOKAWA HIROSHI·Filed 2010·Application pending·0 cites
- 0931US2010327329A1Semiconductor device and method of fabricating the sameITOKAWA HIROSHI·Filed 2010·Application pending·0 cites
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