Assignee
IWATA KEIJI
JP·3 granted patents·1 pending application·20 citations·filing 2005–2013
Top patents by PatentIndex Score
4 records- 0186US8519309B2Wafer heating apparatus and semiconductor manufacturing apparatusIWATA KEIJI·Filed 2010·Granted Aug 27, 2013·8 cites·19 claims
- 0285US8071916B2Wafer heating apparatus and semiconductor manufacturing apparatusIWATA KEIJI·Filed 2005·Granted Dec 6, 2011·11 cites·22 claims
- 0374US8734658B2Method for manufacturing grain-oriented electrical steel sheetIWATA KEIJI·Filed 2011·Granted May 27, 2014·1 cites·3 claims
- 0446US2014045339A1Substrate treatment apparatus and substrate treatment methodIWATA KEIJI·Filed 2013·Application pending·0 cites
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