Assignee
JCET GROUP CO LTD
CN·15 granted patents·25 pending applications·0 citations·filing 2019–2025
Top patents by PatentIndex Score
40 records- 0165US2023212386A1Epoxy molding compounds, preparation method thereof, and use thereofJCET GROUP CO LTD·Filed 2022·Application pending·0 cites
- 0263US2025149415A1Packaging structure and method for forming the sameJCET GROUP CO LTD·Filed 2024·Application pending·0 cites
- 0362US2024413042A1Package structure and method for forming sameJCET GROUP CO LTD·Filed 2024·Application pending·0 cites
- 0461US2024347648A1Package structure and packaging methodJCET GROUP CO LTD·Filed 2024·Application pending·0 cites
- 0561US2026082977A1Stacked package structure and forming method thereofJCET GROUP CO LTD·Filed 2025·Application pending·0 cites
- 0661US2024312861A1Three-dimensional package structure and method for forming sameJCET GROUP CO LTD·Filed 2024·Application pending·0 cites
- 0760US2024413059A1Package structure and method for forming sameJCET GROUP CO LTD·Filed 2024·Application pending·0 cites
- 0860US2026040968A1Package structure and package methodJCET GROUP CO LTD·Filed 2025·Application pending·0 cites
- 0960US2025006578A1Package structure with cavity and related packaging methodJCET GROUP CO LTD·Filed 2024·Application pending·0 cites
- 1060US2025062298A1Package structure and method for forming sameJCET GROUP CO LTD·Filed 2024·Application pending·0 cites
- 1159US2026005155A1Package structure with electromagnetic shielding functionalityJCET GROUP CO LTD·Filed 2025·Application pending·0 cites
- 1259US2024162267A1Microminiature image acquisition and processing system packaging structure and preparation method thereofJCET GROUP CO LTD·Filed 2023·Application pending·0 cites
- 1359US2024128142A1Double-sided sip packaging structure and manufacturing method thereofJCET GROUP CO LTD·Filed 2023·Application pending·0 cites
- 1459US2025062215A1Package structure and method for forming sameJCET GROUP CO LTD·Filed 2024·Application pending·0 cites
- 1558US12581965B2Packaging structure and manufacturing method thereofJCET GROUP CO LTD·Filed 2022·Granted Mar 17, 2026·0 cites·14 claims
- 1658US2024387755A1Packaging structure for electronic devicesJCET GROUP CO LTD·Filed 2024·Application pending·0 cites
- 1757US2025391745A1Package structure and package methodJCET GROUP CO LTD·Filed 2025·Application pending·0 cites
- 1856US12593731B2Packaging structure and manufacturing method thereofJCET GROUP CO LTD·Filed 2022·Granted Mar 31, 2026·0 cites·15 claims
- 1956US12575447B2QFN packaging structure and QFN packaging methodJCET GROUP CO LTD·Filed 2022·Granted Mar 10, 2026·0 cites·6 claims
- 2056US2025391741A1Package structure, stacked package structure, and packaging methodJCET GROUP CO LTD·Filed 2025·Application pending·0 cites
- 2155US12476222B2Fan-out package structureJCET GROUP CO LTD·Filed 2021·Granted Nov 18, 2025·0 cites·9 claims
- 2255US11978694B2Dual-substrate antenna package structure and method for manufacturing the sameJCET GROUP CO LTD·Filed 2021·Granted May 7, 2024·0 cites·9 claims
- 2355US2025391746A1Package structure and package methodJCET GROUP CO LTD·Filed 2025·Application pending·0 cites
- 2453US12148681B2Fan-out package structure and method for manufacturing the sameJCET GROUP CO LTD·Filed 2021·Granted Nov 19, 2024·0 cites·19 claims
- 2553US2024413040A1Package structure and manufacturing method thereofJCET GROUP CO LTD·Filed 2024·Application pending·0 cites
- 2652US12500329B2Antenna packaging structure and manufacturing method thereofJCET GROUP CO LTD·Filed 2021·Granted Dec 16, 2025·0 cites·20 claims
- 2752US2025379199A1Multi-sensor package structure and method for forming the sameJCET GROUP CO LTD·Filed 2025·Application pending·0 cites
- 2851US12469955B2Antenna packaging structure and manufacturing method thereofJCET GROUP CO LTD·Filed 2021·Granted Nov 11, 2025·0 cites·20 claims
- 2951US11854949B2Package structure having a plurality of chips attached to a lead frame by redistribution layerJCET GROUP CO LTD·Filed 2021·Granted Dec 26, 2023·0 cites·20 claims
- 3050US12482765B2Packaging structure and manufacturing method thereofJCET GROUP CO LTD·Filed 2021·Granted Nov 25, 2025·0 cites·16 claims
- 3149US12300590B2Package structure and method for forming sameJCET GROUP CO LTD·Filed 2020·Granted May 13, 2025·0 cites·10 claims
- 3249US2025063745A1Package structure and manufacturing method thereofJCET GROUP CO LTD·Filed 2024·Application pending·0 cites
- 3349US2023187363A1Packaging structure and manufacturing method thereofJCET GROUP CO LTD·Filed 2022·Application pending·0 cites
- 3448US12550261B2Package structure with inductor, and manufacturing method thereofJCET GROUP CO LTD·Filed 2021·Granted Feb 10, 2026·0 cites·24 claims
- 3546US12074116B2Integrated package structureJCET GROUP CO LTD·Filed 2020·Granted Aug 27, 2024·0 cites·14 claims
- 3646US2023048687A1Qfn packaging structure and qfn packaging methodJCET GROUP CO LTD·Filed 2022·Application pending·0 cites
- 3744US12249582B2SIP package structureJCET GROUP CO LTD·Filed 2020·Granted Mar 11, 2025·0 cites·16 claims
- 3842US2023282599A1Fan-out packaging structure and manufacturing method thereofJCET GROUP CO LTD·Filed 2021·Application pending·0 cites
- 3940US2022223574A1Package structure and package method for cavity device groupJCET GROUP CO LTD·Filed 2020·Application pending·0 cites
- 4036US12033955B2Electromagnetic shielding package structure comprising electroplating layer and package method thereofJCET GROUP CO LTD·Filed 2019·Granted Jul 9, 2024·0 cites·10 claims
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