Packaging structure for electronic devices

Abstract

The present disclosure pertains to a packaging structure for electronic devices, which comprises: a substrate and an optical device fixed to the substrate, an upper surface of the optical device has an optical region for receiving and/or transmitting light signals; an outer cover hermetically connected to the upper surface of the optical device and surrounding the optical region, which has an opening; and a transparent inner cover disposed inside the opening and sealing the opening, the upper surface of the optical device, the outer cover and the transparent inner cover are sealed to form a cavity, and a light signal path between the optical region and the exterior of the packaging structure passes through the opening and the transparent inner cover. The present disclosure provides a small cavity packaging structure, which maintains the sealing integrity of the cavity even when the air inside the cavity expands due to heating.

What is claimed is: 
     
         1 . A packaging structure for electronic devices, comprising:
 a substrate;   an optical device fixed to the substrate, an upper surface of the optical device has an optical region for receiving and/or transmitting light signals;   an outer cover hermetically connected to the upper surface of the optical device and surrounding the optical region, the outer cover has an opening; and   a transparent inner cover disposed inside the opening and sealing the opening, the upper surface of the optical device, the outer cover and the transparent inner cover are sealed to form a cavity, a light signal path between the optical region and the exterior of the packaging structure passes through the opening and the transparent inner cover.   
     
     
         2 . The packaging structure of  claim 1 , wherein the upper surface of the optical device has an annular groove, the annular groove is located outside the optical region, and a bottom of the outer cover is inserted in the annular groove and is hermetically connected to the optical device through a binding material. 
     
     
         3 . The packaging structure of  claim 2 , wherein the annular groove comprises a first annular groove and a second annular groove, the first annular groove is arranged outside the second annular groove, and the bottom of the outer cover is inserted in the second annular groove. 
     
     
         4 . The packaging structure of  claim 3 , wherein the annular groove further comprises a third annular groove, and the second annular groove is arranged outside the third annular groove. 
     
     
         5 . The packaging structure of  claim 2 , wherein the annular groove comprises a second annular groove and a third annular groove, the second annular groove is arranged outside the third annular groove, and a bottom of the outer cover is inserted in the second annular groove. 
     
     
         6 . The packaging structure of  claim 1 , wherein an outer wall of the outer cover is provided with a protruding structure, the protruding structure can be bonded integrally with an insulating packaging material. 
     
     
         7 . The packaging structure of  claim 6 , wherein the protruding structure is an annular protrusion surrounding the outer wall of the outer cover. 
     
     
         8 . The packaging structure of  claim 6 , wherein the protruding structure is a sloping shape with a low inside and a high outside or a high inside and a low outside. 
     
     
         9 . The packaging structure of  claim 1 , wherein an area of the opening is larger than an area of the optical region. 
     
     
         10 . The packaging structure of  claim 1 , wherein the outer cover is made of metal material. 
     
     
         11 . The packaging structure of  claim 1 , wherein the packaging structure for electronic devices further comprises an insulating packaging layer, and the outer cover is packaged in the insulating packaging layer with the opening being exposed.