Inventor · disambiguated record
Xianfang Yang
Also filed as: YANG XIANFANG
0 granted patents·4 pending applications·0 citations·filing 2024–2024
Technology areasH10W
Files withJCET GROUP CO LTD4
Top patents by PatentIndex Score
4 records- 0161US2024347648A1Package structure and packaging methodJCET GROUP CO LTD·Filed 2024·Application pending·0 cites
- 0260US2025006578A1Package structure with cavity and related packaging methodJCET GROUP CO LTD·Filed 2024·Application pending·0 cites
- 0358US2024387755A1Packaging structure for electronic devicesJCET GROUP CO LTD·Filed 2024·Application pending·0 cites
- 0449US2025063745A1Package structure and manufacturing method thereofJCET GROUP CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →