Assignee
JCET SEMICONDUCTOR SHAOXING CO LTD
CN·13 granted patents·7 citations·filing 2013–2021
Top patents by PatentIndex Score
13 records- 0177US10643952B2Semiconductor device and method of forming EMI shielding layer with conductive material around semiconductor dieJCET SEMICONDUCTOR SHAOXING CO LTD·Filed 2016·Granted May 5, 2020·2 cites·25 claims
- 0276US11676938B2Semiconductor device and method of making wafer level chip scale packageJCET SEMICONDUCTOR SHAOXING CO LTD·Filed 2017·Granted Jun 13, 2023·2 cites·12 claims
- 0375USRE48111ESemiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnectJCET SEMICONDUCTOR SHAOXING CO LTD·Filed 2017·Granted Jul 21, 2020·2 cites·20 claims
- 0473USRE48408ESemiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnectJCET SEMICONDUCTOR SHAOXING CO LTD·Filed 2017·Granted Jan 26, 2021·1 cites·27 claims
- 0568US12148677B2Semiconductor device and method of forming ultra high density embedded semiconductor die packageJCET SEMICONDUCTOR SHAOXING CO LTD·Filed 2021·Granted Nov 19, 2024·0 cites·20 claims
- 0662US11257729B2Semiconductor device and method of forming encapsulated wafer level chip scale package (eWLCSP)JCET SEMICONDUCTOR SHAOXING CO LTD·Filed 2019·Granted Feb 22, 2022·0 cites·17 claims
- 0757US11127668B2Semiconductor device and method of forming double-sided fan-out wafer level packageJCET SEMICONDUCTOR SHAOXING CO LTD·Filed 2019·Granted Sep 21, 2021·0 cites·24 claims
- 0857US10903183B2Semiconductor device and method of using leadframe bodies to form openings through encapsulant for vertical interconnect of semiconductor dieJCET SEMICONDUCTOR SHAOXING CO LTD·Filed 2014·Granted Jan 26, 2021·0 cites·24 claims
- 0952US10607946B2Semiconductor device and method of forming interconnect substrate for FO-WLCSPJCET SEMICONDUCTOR SHAOXING CO LTD·Filed 2017·Granted Mar 31, 2020·0 cites·17 claims
- 1051US10622293B2Semiconductor device and method for forming a low profile embedded wafer level ball grid array molded laser package (EWLB-MLP)JCET SEMICONDUCTOR SHAOXING CO LTD·Filed 2016·Granted Apr 14, 2020·0 cites·25 claims
- 1150US11227809B2Semiconductor device and method of forming ultra high density embedded semiconductor die packageJCET SEMICONDUCTOR SHAOXING CO LTD·Filed 2017·Granted Jan 18, 2022·0 cites·25 claims
- 1250US10998248B2Semiconductor device and method of forming sacrificial adhesive over contact pads of semiconductor dieJCET SEMICONDUCTOR SHAOXING CO LTD·Filed 2016·Granted May 4, 2021·0 cites·10 claims
- 1349US10916482B2Semiconductor device and method of forming reconstituted wafer with larger carrier to achieve more EWLB packages per wafer with encapsulant deposited under temperature and pressureJCET SEMICONDUCTOR SHAOXING CO LTD·Filed 2013·Granted Feb 9, 2021·0 cites·10 claims
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