Assignee
JCET STATS CHIPPAC KOREA LTD
KR·8 granted patents·60 pending applications·0 citations·filing 2022–2025
Top patents by PatentIndex Score
68 records- 0181US2025385198A1Semiconductor Device and Method of Forming Conductive Structure for EMI Shielding and Heat DissipationJCET STATS CHIPPAC KOREA LTD·Filed 2025·Application pending·0 cites
- 0276US2026018573A1Semiconductor Device and Method of Forming Compartment Shielding for a Semiconductor PackageJCET STATS CHIPPAC KOREA LTD·Filed 2025·Application pending·0 cites
- 0376US2025125233A1Integrated Antenna-In-Package StructureJCET STATS CHIPPAC KOREA LTD·Filed 2024·Application pending·0 cites
- 0476US2026086113A1Apparatus and method for testing a semiconductor packageJCET STATS CHIPPAC KOREA LTD·Filed 2025·Application pending·0 cites
- 0575US2025383399A1Semiconductor Test Equipment and Method of Performing Current and Voltage Test MeasurementsJCET STATS CHIPPAC KOREA LTD·Filed 2025·Application pending·0 cites
- 0673US12211773B2Integrated antenna-in-package structureJCET STATS CHIPPAC KOREA LTD·Filed 2022·Granted Jan 28, 2025·0 cites·25 claims
- 0772US12431437B2Semiconductor device and method of forming conductive structure for EMI shielding and heat dissipationJCET STATS CHIPPAC KOREA LTD·Filed 2022·Granted Sep 30, 2025·0 cites·14 claims
- 0868US12444718B2Semiconductor device and method of forming compartment shielding for a semiconductor packageJCET STATS CHIPPAC KOREA LTD·Filed 2023·Granted Oct 14, 2025·0 cites·19 claims
- 0966US2026002984A1Apparatus and method for testing a semiconductor packageJCET STATS CHIPPAC KOREA LTD·Filed 2025·Application pending·0 cites
- 1064US12379413B2Semiconductor test equipment and method of performing current and voltage test measurementsJCET STATS CHIPPAC KOREA LTD·Filed 2022·Granted Aug 5, 2025·0 cites·25 claims
- 1164US2026083029A1Semiconductor package and method for forming the sameJCET STATS CHIPPAC KOREA LTD·Filed 2025·Application pending·0 cites
- 1264US2026076244A1Method and an apparatus for forming an electronic deviceJCET STATS CHIPPAC KOREA LTD·Filed 2025·Application pending·0 cites
- 1363US2025140679A1Electronic package assembly and methods for forming the sameJCET STATS CHIPPAC KOREA LTD·Filed 2024·Application pending·0 cites
- 1463US2026082974A1Semiconductor Device and Method of Making Using Epoxy-Solder PasteJCET STATS CHIPPAC KOREA LTD·Filed 2024·Application pending·0 cites
- 1563US2025105194A1Method for forming conductive blocks, a semiconductor package and a method for forming the sameJCET STATS CHIPPAC KOREA LTD·Filed 2024·Application pending·0 cites
- 1663US2025140773A1Electronic package assembly and a method for forming the sameJCET STATS CHIPPAC KOREA LTD·Filed 2024·Application pending·0 cites
- 1762US2025391776A1Semiconductor Device and Method of Making Advanced Chiplet Bridge Die with CarrierJCET STATS CHIPPAC KOREA LTD·Filed 2024·Application pending·0 cites
- 1861US2025329662A1Semiconductor Device and Method of Forming Stacked SIP Structure with Single-Sided MoldJCET STATS CHIPPAC KOREA LTD·Filed 2024·Application pending·0 cites
- 1961US2026005191A1Semiconductor Device and Method of Forming Interconnect Structure in HBM Module Using VFMJCET STATS CHIPPAC KOREA LTD·Filed 2024·Application pending·0 cites
- 2061US2025329681A1Semiconductor Device and Method of Making an ETS or Chiplet with Double-Sided Bridge DieJCET STATS CHIPPAC KOREA LTD·Filed 2024·Application pending·0 cites
- 2161US2025385103A1Semiconductor Device and Method of Making Using Microwave SolderingJCET STATS CHIPPAC KOREA LTD·Filed 2024·Application pending·0 cites
- 2260US2025391719A1Semiconductor Device and Method of Using CTAB to Reduce Occurrence of EM Dendrite Short-Circuit Between Interconnect StructuresJCET STATS CHIPPAC KOREA LTD·Filed 2024·Application pending·0 cites
- 2360US2026005190A1Semiconductor Device and Method of Forming Interconnect Structure Using VFM and TCBJCET STATS CHIPPAC KOREA LTD·Filed 2024·Application pending·0 cites
- 2460US2025031317A1Method for mounting an electronic device on a flexible substrate and an electronic packageJCET STATS CHIPPAC KOREA LTD·Filed 2024·Application pending·0 cites
- 2560US2026005046A1Molding apparatus and method for making an electronic packageJCET STATS CHIPPAC KOREA LTD·Filed 2025·Application pending·0 cites
- 2659US2024234336A1Electronic device and method for manufacturing the sameJCET STATS CHIPPAC KOREA LTD·Filed 2023·Application pending·0 cites
- 2759US2026082925A1Shielded interconnection structure, method for forming the same, and semiconductor packageJCET STATS CHIPPAC KOREA LTD·Filed 2025·Application pending·0 cites
- 2858US2025105162A1Semiconductor Device and Method of Forming Fine-Pitch Interconnection Using Insulating LayerJCET STATS CHIPPAC KOREA LTD·Filed 2023·Application pending·0 cites
- 2957US12593397B2Electronic package and method for making the sameJCET STATS CHIPPAC KOREA LTD·Filed 2023·Granted Mar 31, 2026·0 cites·17 claims
- 3057US2025125281A1Semiconductor package assembly and methods for forming the sameJCET STATS CHIPPAC KOREA LTD·Filed 2024·Application pending·0 cites
- 3157US2025329547A1Semiconductor device and method for forming the sameJCET STATS CHIPPAC KOREA LTD·Filed 2025·Application pending·0 cites
- 3257US2026002963A1Probe card and test apparatusJCET STATS CHIPPAC KOREA LTD·Filed 2025·Application pending·0 cites
- 3357US2025038059A1Modular interconnection unit, semiconductor package and method for making the sameJCET STATS CHIPPAC KOREA LTD·Filed 2024·Application pending·0 cites
- 3456US2025132211A1Semiconductor Device and Method of Forming Flexible Encapsulant Over Thin Electrical ComponentJCET STATS CHIPPAC KOREA LTD·Filed 2023·Application pending·0 cites
- 3556US2024347509A1Semiconductor package strip and method for forming a semiconductor deviceJCET STATS CHIPPAC KOREA LTD·Filed 2024·Application pending·0 cites
- 3656US2025167168A1Electronic package with integrated antennas and a method for forming the sameJCET STATS CHIPPAC KOREA LTD·Filed 2024·Application pending·0 cites
- 3756US2024404911A1Semiconductor package with improved heat dissipationJCET STATS CHIPPAC KOREA LTD·Filed 2024·Application pending·0 cites
- 3856US2025125295A1Semiconductor package and method for making the sameJCET STATS CHIPPAC KOREA LTD·Filed 2024·Application pending·0 cites
- 3955US2024332114A1Semiconductor device with improved heat dissipation and method for making the sameJCET STATS CHIPPAC KOREA LTD·Filed 2024·Application pending·0 cites
- 4054US2025364275A1Method and apparatus for forming semiconductor deviceJCET STATS CHIPPAC KOREA LTD·Filed 2025·Application pending·0 cites
- 4154US2025323208A1Method for forming an electronic deviceJCET STATS CHIPPAC KOREA LTD·Filed 2025·Application pending·0 cites
- 4254US2024421015A1Semiconductor package and method for forming the sameJCET STATS CHIPPAC KOREA LTD·Filed 2024·Application pending·0 cites
- 4354US2024355643A1Semiconductor device with a partial shielding layer and a method for making the sameJCET STATS CHIPPAC KOREA LTD·Filed 2024·Application pending·0 cites
- 4453US2024120289A1Electronic package and a method for making the sameJCET STATS CHIPPAC KOREA LTD·Filed 2023·Application pending·0 cites
- 4553US2025201733A1Semiconductor Device and Method of Forming Protective Layer on Substrate to Avoid Damage During EncapsulationJCET STATS CHIPPAC KOREA LTD·Filed 2023·Application pending·0 cites
- 4653US2024332050A1Carrier assembly for carrying semiconductor package strips with improved warpage controlJCET STATS CHIPPAC KOREA LTD·Filed 2024·Application pending·0 cites
- 4753US2025273480A1Semiconductor device with improved heat dissipation and a method for forming the sameJCET STATS CHIPPAC KOREA LTD·Filed 2025·Application pending·0 cites
- 4853US2025118599A1Semiconductor Device and Method of Forming Embedded Trace Substrate with Barrier Layer to Inhibit ElectromigrationJCET STATS CHIPPAC KOREA LTD·Filed 2023·Application pending·0 cites
- 4952US2025038058A1Semiconductor Device and Method of Forming an Antenna-in-Package StructureJCET STATS CHIPPAC KOREA LTD·Filed 2023·Application pending·0 cites
- 5052US2024371759A1Semiconductor Device and Method of Making a Multi-Tier System-in-PackageJCET STATS CHIPPAC KOREA LTD·Filed 2023·Application pending·0 cites
Showing the top 50 of 68 patent records by PatentIndex Score.
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