Method for forming conductive blocks, a semiconductor package and a method for forming the same

Abstract

A method for forming conductive blocks on a package substrate, a semiconductor package and a method for forming the same is provided. The method for forming conductive blocks on a package substrate comprises: providing a package substrate with multiple sets of conductive pads formed thereon; depositing a solder material onto the package substrate to form solder bumps on the multiple sets of conductive pads; attaching multiple conductive blocks onto the package substrate, wherein each of the multiple conductive bloc aligned with one of the multiple sets of conductive pads; loading the package substrate on a bottom chase with the multiple conductive blocks facing upward; and pressing, with a top chase, the conductive blocks against the bottom chase to reshape the solder bumps and horizontally align top surfaces of the multiple conductive blocks with each other.

1 . A method for forming conductive blocks on a package substrate, comprising:
 providing a package substrate with multiple sets of conductive pads formed thereon;   depositing a solder material onto the package substrate to form solder bumps on the multiple sets of conductive pads;   attaching multiple conductive blocks onto the package substrate, wherein each of the multiple conductive blocks is aligned with one of the multiple sets of conductive pads;   loading the package substrate on a bottom chase with the multiple conductive blocks facing upward; and   pressing, with a top chase, the conductive blocks against the bottom chase to reshape the solder bumps and horizontally align top surfaces of the multiple conductive blocks with each other.   
     
     
         2 . The method of  claim 1 , wherein the top chase comprises a base plate and a flexible film, and the flexible film is in contact with the top surfaces of the multiple conductive blocks during the pressing step. 
     
     
         3 . The method of  claim 1 , wherein the conductive blocks are e-bar blocks. 
     
     
         4 . The method of  claim 1 , wherein the solder bumps on each set of conductive pads are reshaped but not connected with each other after the pressing step. 
     
     
         5 . A method for forming a semiconductor package, comprising:
 providing a package substrate having a front surface and a back surface, wherein multiple sets of conductive pads are formed on the front surface of the package substrate;   depositing a solder material onto the front surface of the package substrate to form solder bumps on the multiple sets of conductive pads;   attaching an electronic component and multiple conductive blocks onto the front surface of the package substrate, wherein each of the multiple conductive blocks is aligned with one of the multiple sets of conductive pads, and the multiple conductive blocks are thicker than electronic component;   loading the package substrate on a bottom chase with the front surface of the package substrate facing upward; and   pressing, with a top chase, the conductive blocks against the bottom chase to reshape the solder bumps and horizontally align top surfaces of the multiple conductive blocks with each other;   forming a molding material between the top chase and the front surface of the package substrate to encapsulate the multiple conductive blocks and the electronic component but expose the top surfaces of the multiple conductive blocks; and   depositing a solder material on the top surfaces of the multiple conductive blocks to form solder bumps thereon.   
     
     
         6 . The method of  claim 5 , wherein before the step of depositing a solder material on the top surfaces of the multiple conductive blocks, the method further comprises:
 attaching one or more electronic components onto the back surface of the package substrate; and   forming a molding material on the back surface of the package substrate to encapsulate the one or more electronic components.   
     
     
         7 . The method of  claim 6 , further comprising:
 forming a shielding layer at least outside the molding material on the back surface of the package substrate.   
     
     
         8 . The method of  claim 5 , wherein the top chase comprises a base plate and a flexible film, and the flexible film is in contact with the top surfaces of the multiple conductive blocks during the pressing step. 
     
     
         9 . The method of  claim 5 , wherein the conductive blocks are e-bar blocks. 
     
     
         10 . The method of  claim 5 , wherein the solder bumps on each set of conductive pads are reshaped but not connected with each other after the pressing step. 
     
     
         11 . A semiconductor package which is formed using the method of  claim 5 .