Inventor · disambiguated record
Sangjun Park
Also filed as: PARK SANGJUN
43 granted patents·37 pending applications·125 citations·filing 1999–2025
96Inventor score
Files withSAMSUNG ELECTRONICS CO LTD43LG ELECTRONICS INC7ENERGIUM CO LTD4HYUNDAI MOTOR CO LTD4JCET STATS CHIPPAC KOREA LTD4
Top patents by PatentIndex Score
80 records- 0191US11532581B2Semiconductor devices having bonding structures with bonding pads and metal patternsSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 20, 2022·3 cites·20 claims
- 0290US11380606B2Semiconductor device including via structure with head and body portionsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 5, 2022·3 cites·18 claims
- 0383US6472290B2Isolation in micromachined single crystal silicon using deep trench insulationCHROMUX TECHNOLOGIES INC·Filed 2001·Granted Oct 29, 2002·38 cites·19 claims
- 0480US10507818B2Shift control apparatus and method for vehicleHYUNDAI MOTOR CO LTD·Filed 2017·Granted Dec 17, 2019·2 cites·14 claims
- 0580US2025023227A1Antenna-in-Package Devices and Methods of MakingSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 0676US6569702B2Triple layer isolation for silicon microstructure and structures formed using the sameCHROMUX TECHNOLOGIES INC·Filed 2001·Granted May 27, 2003·25 cites·21 claims
- 0774US11404045B2Speech synthesis method and apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 2, 2022·1 cites·17 claims
- 0874US9111953B2Integrated circuit devices with capacitor and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Aug 18, 2015·4 cites·15 claims
- 0974US2025087531A1Semiconductor chip structureSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1073US12209296B2Aluminium alloy for die casting, method for manufacturing same, and die casting methodSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jan 28, 2025·1 cites·14 claims
- 1173US12136759B2Antenna-in-package devices and methods of makingSTATS CHIPPAC PTE LTD·Filed 2021·Granted Nov 5, 2024·0 cites·23 claims
- 1269US2025375852A1Electric grinder with safety measuresAIMSAK CO LTD·Filed 2023·Application pending·0 cites
- 1368US6689694B1Micromechanical system fabrication method using (111) single crystalline siliconCHO DONG II·Filed 2000·Granted Feb 10, 2004·10 cites·23 claims
- 1467US6150275AMicromechanical system fabrication method using (111) single crystalline siliconFiled 1999·Granted Nov 21, 2000·20 cites·2 claims
- 1566US11798866B2Semiconductor device including via structures with undercut portions and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 24, 2023·0 cites·20 claims
- 1665US11138032B2Electronic device and method for operating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Oct 5, 2021·1 cites·16 claims
- 1765US10507835B2System for controlling cornering of vehicle and method thereofHYUNDAI MOTOR CO LTD·Filed 2017·Granted Dec 17, 2019·1 cites·13 claims
- 1865US6724204B2Probe structure for testing semiconductor devices and method for fabricating the sameIC MEMS INC·Filed 2002·Granted Apr 20, 2004·14 cites·7 claims
- 1963US2024153599A1System and method for automating self-experimentation based on lifelog data for health behavior changeKOREA ADVANCED INST SCI & TECH·Filed 2023·Application pending·0 cites
- 2063US2025105194A1Method for forming conductive blocks, a semiconductor package and a method for forming the sameJCET STATS CHIPPAC KOREA LTD·Filed 2024·Application pending·0 cites
- 2161US12463053B2Method for etching high aspect ratio structuresAPPLIED MATERIALS INC·Filed 2023·Granted Nov 4, 2025·0 cites·17 claims
- 2261US12176245B2Semiconductor chip structureSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 24, 2024·0 cites·16 claims
- 2360US12266343B2Electronic device and control method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 1, 2025·0 cites·13 claims
- 2460US2025336882A1Substrate alignment methodSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2560US2025266397A1Semiconductor package including multiple chip structuresSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2660US2025113647A1X-ray detector comprising scintillator, which comprises perovskite compoundLG ELECTRONICS INC·Filed 2022·Application pending·0 cites
- 2760US2025308978A1Substrate bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2859US11990450B2Device including first structure having peripheral circuit and second structure having gate layersSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 21, 2024·0 cites·19 claims
- 2959US9098240B2Mobile terminal and control method for the mobile terminalLG ELECTRONICS INC·Filed 2014·Granted Aug 4, 2015·2 cites·35 claims
- 3059US2024234336A1Electronic device and method for manufacturing the sameJCET STATS CHIPPAC KOREA LTD·Filed 2023·Application pending·0 cites
- 3158US11915629B2Display apparatus and control method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 27, 2024·0 cites·22 claims
- 3258US11848004B2Electronic device and method for controlling thereofSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 19, 2023·0 cites·20 claims
- 3358US2025218849A1Wafer bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3458US2024373621A1Method for manufacturing a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3557US2019286785A1Design method of semiconductor integrated circuit layoutSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 3657US2025349578A1Method of operating computing device communicating with semiconductor manufacturing equipment, and method of operating semiconductor manufacturing system including semiconductor manufacturing equipment and computing deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3757US2024429052A1Method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3857US2025091810A1Conveying device including outer rotor motorENERGIUM CO LTD·Filed 2024·Application pending·0 cites
- 3957US2025305682A1Range hood and control method thereforSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 4057US2025091813A1Conveying device including spiral trackENERGIUM CO LTD·Filed 2024·Application pending·0 cites
- 4157US2025091793A1Test tube supplying device including test tube supply module and test tube supplying method using the sameENERGIUM CO LTD·Filed 2024·Application pending·0 cites
- 4256US2025271224A1High potential and high corrosion resistance aluminum alloy and high corrosion resistance heat exchangerSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 4356US2025125295A1Semiconductor package and method for making the sameJCET STATS CHIPPAC KOREA LTD·Filed 2024·Application pending·0 cites
- 4455US12450024B2Display device and method for sharing screens of electronic devicesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 21, 2025·0 cites·19 claims
- 4555US12367888B2Electronic device and control method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 22, 2025·0 cites·13 claims
- 4655US12288488B2Display apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Apr 29, 2025·0 cites·18 claims
- 4755US11763799B2Electronic apparatus and controlling method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Sep 19, 2023·0 cites·15 claims
- 4855US2021389973A1Electronic device and method for operating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Application pending·0 cites
- 4955US2024082904A1Apparatus and method for manufacturing heat exchangerSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 5054US2025062131A1Plasma etching in semiconductor processingAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
Showing the top 50 of 80 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →