Assignee
JEONG IN KWON
2 granted patents·5 pending applications·23 citations·filing 2003–2010
Top patents by PatentIndex Score
7 records- 0179US7022193B2Apparatus and method for treating surfaces of semiconductor wafers using ozoneJEONG IN KWON·Filed 2003·Granted Apr 4, 2006·20 cites·57 claims
- 0270US7258124B2Apparatus and method for treating surfaces of semiconductor wafers using ozoneJEONG IN KWON·Filed 2006·Granted Aug 21, 2007·3 cites·16 claims
- 0347US2005282472A1CMP apparatus and method for polishing multiple semiconductor wafers on a single polishing pad using multiple slurry delivery linesJEONG IN KWON·Filed 2005·Application pending·0 cites
- 0446US2009061739A1Polishing apparatus and method for polishing semiconductor wafers using load-unload stationsJEONG IN-KWON·Filed 2008·Application pending·0 cites
- 0544US2008038993A1Apparatus and method for polishing semiconductor wafersJEONG IN-KWON·Filed 2007·Application pending·0 cites
- 0640US2006281393A1Chemical mechanical polishing tool, apparatus and methodJEONG IN KWON·Filed 2005·Application pending·0 cites
- 0736US2011104997A1Apparatuses and methods for polishing and cleaning semiconductor wafersJEONG IN-KWON·Filed 2010·Application pending·0 cites
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