Apparatuses and methods for polishing and cleaning semiconductor wafers

Abstract

Wafer processing apparatuses and methods for polishing and cleaning semiconductor wafers with high productivity, small footprint, easy maintenance and low defectivity are provided. The apparatuses comprise a polishing apparatus and a cleaning apparatus. The polishing apparatus comprises at least one polishing module. Each module comprises at least one polishing surface, at least one polishing head, at least one wafer transfer station and a transport mechanism to transfer the at least one polishing head between the at least one polishing surface and the at least one wafer transfer station. The polishing module may comprise a shield member and fluid injection devices to protect the at least one polishing surface from foreign particles. The cleaning apparatus can comprise two or more dry chambers for high productivity. The wafer processing apparatuses can comprise two cleaning apparatuses for high productivity.

1 . An apparatus for polishing an object comprising:
 at least one polishing surface supported on at least one polishing table;   at least one polishing head assembly comprising at least one polishing head;   at least one object transfer station configured to transfer said object with said at least one polishing head when said at least one polishing head is positioned about said object transfer station; and   a transport mechanism configured to transport said at least one polishing head assembly between said at least one polishing surface and said at least one object transfer station, said transport mechanism comprising;
 a support structure comprising an opening disposed over said at least one polishing surface and said at least one object transfer station; 
 at least one inner guide rail supported by said support structure, wherein said at least one inner guide rail is surrounded by said opening; 
 at least one first guide block slidibly coupled to said at least one inner guide rail; 
 at least one outer guide rail supported by said support structure, wherein said at least one outer guide rail surrounds said opening; 
 at least one second guide block slidibly coupled to said outer guide rail; 
 at least one head supporting member mounted to said at least one first guide block and said at least one second guide block, wherein said at least one head supporting member supports said at least one polishing head assembly; and 
 at least one drive mechanism coupled to said at least one head supporting member, wherein said at least one drive mechanism is configured to transport said at least one polishing head assembly coupled to said at least one head supporting member between said at least one polishing surface and said at least one object transfer station. 
   
     
     
         2 . The apparatus of  claim 1 , wherein said transport mechanism further comprises at least one shield member disposed in a space over said at least one head supporting member and below said at least one drive mechanism. 
     
     
         3 . The apparatus of  claim 1 , wherein said opening and said at least one inner and outer guide rails of said transport mechanism have annular shapes. 
     
     
         4 . The apparatus of  claim 2 , wherein said shield member of said transport mechanism has an annular shape. 
     
     
         5 . The apparatus of  claim 2 , wherein said shield member of said transport mechanism is disposed over said opening, at least a part of said at least one inner guide rail, and at least a part of said at least one outer guide rail. 
     
     
         6 . The apparatus of  claim 1 , wherein said transport mechanism is configured to transport said at least one polishing head assembly rotationally about an axis between said at least one polishing surface and said at least one object transfer station. 
     
     
         7 . The apparatus of  claim 1 , wherein said at least one drive mechanism of said transport mechanism comprises a gear mounted to said support structure and at least one servo motor mounted to said at least one head support member, wherein said at least one servo motor is movably coupled to said gear. 
     
     
         8 . The apparatus of  claim 1 , wherein said at least one polishing surface comprises two polishing surfaces and said at least one object transfer station comprises one object transfer station, wherein said two polishing surfaces and said one object transfer station are disposed angularly about an axis. 
     
     
         9 . The apparatus of  claim 1 , wherein said at least one polishing surface comprises three polishing surfaces and said at least one object transfer station comprises two object transfer station, wherein said three polishing surfaces and said two object transfer stations are disposed angularly about an axis such that said two object transfer stations are disposed adjacent to each other. 
     
     
         10 . The apparatus of  claim 1 , wherein said transport mechanism further comprises an inner fluid injection device disposed about said at least one inner guide rail, wherein said inner fluid injection device is configured to inject pressurized air toward opposite to said opening. 
     
     
         11 . The apparatus of  claim 1 , wherein said transport mechanism further comprises an outer fluid injection device disposed about said at least one outer guide rail, wherein said outer fluid injection device is configured to inject pressurized air toward opposite to said opening. 
     
     
         12 . The apparatus of  claim 1 , wherein said transport mechanism further comprises an inner fluid injection device disposed about said at least one inner guide rail, wherein said inner fluid injection device is configured to inject pressurized air toward said opening. 
     
     
         13 . The apparatus of  claim 1 , wherein said transport mechanism further comprises an outer fluid injection device disposed about said at least one outer guide rail, wherein said outer fluid injection device is configured to inject pressurized air toward said opening.