Assignee
JMJ KOREA CO LTD
KR·36 granted patents·17 pending applications·28 citations·filing 2015–2024
Top patents by PatentIndex Score
53 records- 0196US11127663B2Semiconductor package having exposed heat sink for high thermal conductivityJMJ KOREA CO LTD·Filed 2020·Granted Sep 21, 2021·4 cites·21 claims
- 0291US11676931B2Semiconductor packageJMJ KOREA CO LTD·Filed 2022·Granted Jun 13, 2023·2 cites·13 claims
- 0390US11270969B2Semiconductor packageJMJ KOREA CO LTD·Filed 2020·Granted Mar 8, 2022·3 cites·18 claims
- 0487US10855009B2Press-fit pin, semiconductor package having the same and method for manufacturing the press-fit pinJMJ KOREA CO LTD·Filed 2019·Granted Dec 1, 2020·7 cites·13 claims
- 0581US11682610B2Semiconductor package with heat radiation boardJMJ KOREA CO LTD·Filed 2020·Granted Jun 20, 2023·1 cites·18 claims
- 0676US10438873B2Semiconductor chip package having heat dissipating structureJMJ KOREA CO LTD·Filed 2017·Granted Oct 8, 2019·3 cites·3 claims
- 0774US12447550B2Ultrasonic welding system and power module package for power converting apparatus to which substrate where connection member is ultrasonic welded by using the same is appliedJMJ KOREA CO LTD·Filed 2024·Granted Oct 21, 2025·0 cites·18 claims
- 0874US11367666B2Clip, lead frame, and substrate used in semiconductor package having engraved pattern formed thereon and the semiconductor package comprising the sameJMJ KOREA CO LTD·Filed 2018·Granted Jun 21, 2022·2 cites·35 claims
- 0972US9685397B2Semiconductor package with clip structureJMJ KOREA CO LTD·Filed 2015·Granted Jun 20, 2017·2 cites·12 claims
- 1071US10249552B2Semiconductor package having double-sided heat dissipation structureJMJ KOREA CO LTD·Filed 2018·Granted Apr 2, 2019·2 cites·5 claims
- 1169US10535589B2Clip structure and semiconductor package using the sameJMJ KOREA CO LTD·Filed 2018·Granted Jan 14, 2020·1 cites·14 claims
- 1265US10204848B2Semiconductor chip package having heat dissipating structureJMJ KOREA CO LTD·Filed 2018·Granted Feb 12, 2019·1 cites·5 claims
- 1362US2025309026A1Semiconductor moduleJMJ KOREA CO LTD·Filed 2024·Application pending·0 cites
- 1462US2025246577A1Double-sided heat dissipation semiconductor package and method of manufacturing the sameJMJ KOREA CO LTD·Filed 2024·Application pending·0 cites
- 1562US2025218894A1Semiconductor module including heat radiation systemJMJ KOREA CO LTD·Filed 2024·Application pending·0 cites
- 1661US2024395761A1Metal clip structure and semiconductor package including the sameJMJ KOREA CO LTD·Filed 2024·Application pending·0 cites
- 1761US2024379612A1Apparatus for bonding clip, method of bonding clip, and semiconductor package including semiconductor chip to which clip is bonded using the methodJMJ KOREA CO LTD·Filed 2024·Application pending·0 cites
- 1860US12451410B2Semiconductor package module including vertical terminalsJMJ KOREA CO LTD·Filed 2023·Granted Oct 21, 2025·0 cites·20 claims
- 1960US12170260B2Semiconductor package and method of manufacturing the sameJMJ KOREA CO LTD·Filed 2021·Granted Dec 17, 2024·0 cites·15 claims
- 2060US2024355723A1Semiconductor package and method of manufacturing the sameJMJ KOREA CO LTD·Filed 2023·Application pending·0 cites
- 2160US2024290700A1Bonding substrate, semiconductor package having double-sided substrate, method of manufacturing the bonding substrate, and method of manufacturing the semiconductor package having double-sided substrateJMJ KOREA CO LTD·Filed 2023·Application pending·0 cites
- 2259US12400991B2Clip structure for semiconductor package and semiconductor package including the sameJMJ KOREA CO LTD·Filed 2022·Granted Aug 26, 2025·0 cites·20 claims
- 2359US2024250057A1Semiconductor package and method of manufacturing the sameJMJ KOREA CO LTD·Filed 2023·Application pending·0 cites
- 2459US2024234288A1Semiconductor packageJMJ KOREA CO LTD·Filed 2023·Application pending·0 cites
- 2558US2024297096A1Semiconductor package having heat emitting post bonded thereto and method of manufacturing the sameJMJ KOREA CO LTD·Filed 2023·Application pending·0 cites
- 2657US11521920B2Plurality of power semiconductor chips between a substrate and leadframeJMJ KOREA CO LTD·Filed 2021·Granted Dec 6, 2022·0 cites·20 claims
- 2757US2024178094A1Semiconductor packageJMJ KOREA CO LTD·Filed 2023·Application pending·0 cites
- 2856US11631627B2Method of manufacturing semiconductor having double-sided substrateJMJ KOREA CO LTD·Filed 2021·Granted Apr 18, 2023·0 cites·21 claims
- 2956US11417577B2Semiconductor package and method of manufacturing the sameJMJ KOREA CO LTD·Filed 2021·Granted Aug 16, 2022·0 cites·20 claims
- 3056US11171074B2Heat sink board, manufacturing method thereof, and semiconductor package including the sameJMJ KOREA CO LTD·Filed 2020·Granted Nov 9, 2021·0 cites·17 claims
- 3156US2023238297A1Semiconductor package and method of fabricating the sameJMJ KOREA CO LTD·Filed 2023·Application pending·0 cites
- 3255US11721615B2Coupled semiconductor packageJMJ KOREA CO LTD·Filed 2021·Granted Aug 8, 2023·0 cites·13 claims
- 3355US2023282566A1Semiconductor package having negative patterned substrate and method of manufacturing the sameJMJ KOREA CO LTD·Filed 2022·Application pending·0 cites
- 3455US2025174521A9Semiconductor package including heat radiation structure, cooling system applying the semiconductor package, substrate including heat radiation structure and method of manufacturing the substrateJMJ KOREA CO LTD·Filed 2022·Application pending·0 cites
- 3554US12027445B2System for cooling semiconductor component, method of manufacturing the same, and semiconductor package having the systemJMJ KOREA CO LTD·Filed 2021·Granted Jul 2, 2024·0 cites·17 claims
- 3654US11482463B2Vertically attaching a chip to a substrateJMJ KOREA CO LTD·Filed 2020·Granted Oct 25, 2022·0 cites·18 claims
- 3754US11289397B2Heat sink board for a semiconductor deviceJMJ KOREA CO LTD·Filed 2020·Granted Mar 29, 2022·0 cites·16 claims
- 3853US11908824B2Semiconductor package, method of manufacturing the same and metal bridge applied to the semiconductor packageJMJ KOREA CO LTD·Filed 2022·Granted Feb 20, 2024·0 cites·20 claims
- 3953US11908766B2Cooling system where semiconductor component comprising semiconductor chip and cooling apparatus are joinedJMJ KOREA CO LTD·Filed 2021·Granted Feb 20, 2024·0 cites·20 claims
- 4053US11362021B2Pressurizing members for semiconductor packageJMJ KOREA CO LTD·Filed 2020·Granted Jun 14, 2022·0 cites·18 claims
- 4153US2023011694A1Semiconductor package having package housing in engraved surface form and method of manufacturing the sameJMJ KOREA CO LTD·Filed 2022·Application pending·0 cites
- 4251US11393744B2Metal powder layers between substrate, semiconductor chip and conductorJMJ KOREA CO LTD·Filed 2021·Granted Jul 19, 2022·0 cites·21 claims
- 4350US11798864B2Semiconductor package with metal post having non-vertical structureJMJ KOREA CO LTD·Filed 2021·Granted Oct 24, 2023·0 cites·12 claims
- 4449US11823920B2Apparatus for attaching semiconductor partsJMJ KOREA CO LTD·Filed 2020·Granted Nov 21, 2023·0 cites·18 claims
- 4547US10896889B2Multilayer clip structure attached to a chipJMJ KOREA CO LTD·Filed 2019·Granted Jan 19, 2021·0 cites·13 claims
- 4644US10541197B2Press-fit pin and semiconductor package including the sameJMJ KOREA CO LTD·Filed 2018·Granted Jan 21, 2020·0 cites·13 claims
- 4742US11189550B2Low-cost semiconductor package using conductive metal structureJMJ KOREA CO LTD·Filed 2019·Granted Nov 30, 2021·0 cites·10 claims
- 4838US11056420B2Pressing-type semiconductor power device packageJMJ KOREA CO LTD·Filed 2018·Granted Jul 6, 2021·0 cites·9 claims
- 4938US10256207B2Clip-bonded semiconductor chip package using metal bumps and method for manufacturing the packageJMJ KOREA CO LTD·Filed 2018·Granted Apr 9, 2019·0 cites·4 claims
- 5038US2021166997A1Semiconductor package using conductive metal structureJMJ KOREA CO LTD·Filed 2019·Application pending·0 cites
Showing the top 50 of 53 patent records by PatentIndex Score.
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