Assignee
JOMAA HOUSSAM
US·5 granted patents·2 pending applications·16 citations·filing 2007–2012
Top patents by PatentIndex Score
7 records- 0179US8276269B2Dual epoxy dielectric and photosensitive solder mask coatings, and processes of making sameJOMAA HOUSSAM·Filed 2008·Granted Oct 2, 2012·8 cites·21 claims
- 0277US8555494B2Method of manufacturing coreless substrateJOMAA HOUSSAM·Filed 2007·Granted Oct 15, 2013·7 cites·20 claims
- 0367US9398699B2Dual epoxy dielectric and photosensitive solder mask coatings, and processes of making sameJOMAA HOUSSAM·Filed 2012·Granted Jul 19, 2016·1 cites·14 claims
- 0453US8268724B2Alternative to desmear for build-up roughening and copper adhesion promotionJOMAA HOUSSAM·Filed 2009·Granted Sep 18, 2012·0 cites·9 claims
- 0551US2011135883A1Method of manufacturing a substrate for a microelectronic device, and substrate formed therebyJOMAA HOUSSAM·Filed 2011·Application pending·0 cites
- 0647US8067266B2Methods for the fabrication of microelectronic device substrates by attaching two cores together during fabricationJOMAA HOUSSAM·Filed 2009·Granted Nov 29, 2011·0 cites·18 claims
- 0744US2009152743A1Routing layer for a microelectronic device, microelectronic package containing same, and method of forming a multi-thickness conductor in same for a microelectronic deviceJOMAA HOUSSAM·Filed 2007·Application pending·0 cites
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