Method of manufacturing a substrate for a microelectronic device, and substrate formed thereby

Abstract

A method of manufacturing a substrate for a microelectronic device comprises providing a dielectric material ( 120, 220, 920 ) as a build-up layer of the substrate, applying a primer ( 140, 240, 940 ) to a surface ( 121, 221, 921 ) of the dielectric material, and forming an electrically conductive layer ( 150, 250, 950 ) over the primer. In another embodiment, the method comprises providing the dielectric material, forming the feature extending into the dielectric material, forming the electrically conductive layer over the dielectric material, applying the primer to a surface of the electrically conductive layer and attaching a dielectric layer ( 960 ) to the primer.

1 . A substrate for a microelectronic device comprising:
 a dielectric material that is a build-up layer of the substrate;   a feature extending into the dielectric material;   a primer over a surface of the dielectric material; and   an electrically conductive layer adjacent to the primer.   
     
     
         2 . The substrate of  claim 1  wherein:
 at least a portion of the electrically conductive layer is located above the surface of the dielectric material. 
 
     
     
         3 . The substrate of  claim 1  wherein:
 the electrically conductive layer is embedded within the dielectric material. 
 
     
     
         4 . The substrate of  claim 1  further comprising:
 a dielectric layer over the electrically conductive layer.