Individual holder
KANG SUNG K
US·1 granted patent·1 pending application·9 citations·filing 2004–2009
Individually held — no corporate assignee on record.
Top patents by PatentIndex Score
2 records- 0177US9082762B2Electromigration-resistant under-bump metallization of nickel-iron alloys for Sn-rich solder bumps in Pb-free flip-clipKANG SUNG K·Filed 2009·Granted Jul 14, 2015·9 cites·31 claims
- 0237US2006024943A1Prevention and control of intermetallic alloy inclusions that form during reflow of Pb free, Sn rich, solders in contacts in microelectronic packaging in integrated circuit contact structures where electroless Ni(P) metallization is presentKANG SUNG K·Filed 2004·Application pending·0 cites
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