Assignee
KARIYA TAKASHI
JP·18 granted patents·58 citations·filing 2006–2012
Top patents by PatentIndex Score
18 records- 0185US8164920B2Printed wiring boardKARIYA TAKASHI·Filed 2006·Granted Apr 24, 2012·12 cites·15 claims
- 0284US8541691B2Heat resistant substrate incorporated circuit wiring boardKARIYA TAKASHI·Filed 2010·Granted Sep 24, 2013·4 cites·30 claims
- 0383US8253030B2Multilayer printed wiring boardKARIYA TAKASHI·Filed 2010·Granted Aug 28, 2012·4 cites·13 claims
- 0482US8507806B2Heat resistant substrate incorporated circuit wiring boardKARIYA TAKASHI·Filed 2009·Granted Aug 13, 2013·6 cites·20 claims
- 0581US8654538B2Wiring board and method for manufacturing the sameKARIYA TAKASHI·Filed 2011·Granted Feb 18, 2014·5 cites·20 claims
- 0680US8829355B2Multilayer printed wiring boardKARIYA TAKASHI·Filed 2009·Granted Sep 9, 2014·8 cites·18 claims
- 0776US8415781B2Electronic component and method for manufacturing the sameKARIYA TAKASHI·Filed 2011·Granted Apr 9, 2013·4 cites·17 claims
- 0876US8169792B2Multilayer printed wiring boardKARIYA TAKASHI·Filed 2011·Granted May 1, 2012·3 cites·10 claims
- 0973US8334466B2Multilayer printed wiring boardKARIYA TAKASHI·Filed 2010·Granted Dec 18, 2012·2 cites·13 claims
- 1072US8225503B2Method for manufacturing board with built-in electronic elementsKARIYA TAKASHI·Filed 2008·Granted Jul 24, 2012·5 cites·10 claims
- 1164US8395054B2Substrate for mounting semiconductor element and method for manufacturing substrate for mounting semiconductor elementKARIYA TAKASHI·Filed 2009·Granted Mar 12, 2013·2 cites·9 claims
- 1260US8707552B2High-dielectric sheet, a printed circuit board having the high-dielectric sheet and production methods thereofKARIYA TAKASHI·Filed 2006·Granted Apr 29, 2014·1 cites·10 claims
- 1360US8409461B2Method of manufacturing printed wiring board with component mounting pinKARIYA TAKASHI·Filed 2006·Granted Apr 2, 2013·1 cites·12 claims
- 1458US8563420B2Multilayer printed wiring boardKARIYA TAKASHI·Filed 2012·Granted Oct 22, 2013·0 cites·20 claims
- 1558US8124882B2Multilayer printed wiring boardKARIYA TAKASHI·Filed 2009·Granted Feb 28, 2012·0 cites·15 claims
- 1658US8108990B2Method for manufacturing printed circuit boardKARIYA TAKASHI·Filed 2008·Granted Feb 7, 2012·1 cites·20 claims
- 1753US8093508B2Printed wiring board and method of manufacturing the sameKARIYA TAKASHI·Filed 2010·Granted Jan 10, 2012·0 cites·8 claims
- 1852US8837160B2High-dielectric sheet, a printed circuit board having the high-dielectric sheet and production methods thereofKARIYA TAKASHI·Filed 2011·Granted Sep 16, 2014·0 cites·10 claims
Join the waitlist — get patent alerts
Get an alert when KARIYA TAKASHI files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →