Assignee
KOLICS ARTUR
US·11 granted patents·4 pending applications·42 citations·filing 2008–2012
Top patents by PatentIndex Score
15 records- 0190US8404626B2Post-deposition cleaning methods and formulations for substrates with cap layersKOLICS ARTUR·Filed 2008·Granted Mar 26, 2013·14 cites·22 claims
- 0283US8632628B2Solutions and methods for metal depositionKOLICS ARTUR·Filed 2010·Granted Jan 21, 2014·2 cites·30 claims
- 0381US8328919B2Electroless deposition solutions and process controlKOLICS ARTUR·Filed 2010·Granted Dec 11, 2012·4 cites·16 claims
- 0480US8921296B2Post deposition wafer cleaning formulationKOLICS ARTUR·Filed 2010·Granted Dec 30, 2014·4 cites·12 claims
- 0580US8736055B2Methods and layers for metallizationKOLICS ARTUR·Filed 2012·Granted May 27, 2014·9 cites·36 claims
- 0676US9058975B2Cleaning solution formulations for substratesKOLICS ARTUR·Filed 2008·Granted Jun 16, 2015·5 cites·11 claims
- 0775US9048088B2Processes and solutions for substrate cleaning and electroless depositionKOLICS ARTUR·Filed 2009·Granted Jun 2, 2015·4 cites·36 claims
- 0856US2009072190A1Cleaning solution formulations for substratesKOLICS ARTUR·Filed 2008·Application pending·0 cites
- 0951US8895441B2Methods and materials for anchoring gapfill metalsKOLICS ARTUR·Filed 2012·Granted Nov 25, 2014·0 cites·34 claims
- 1050US8518826B2Metallization processes, mixtures, and electronic devicesKOLICS ARTUR·Filed 2010·Granted Aug 27, 2013·0 cites·21 claims
- 1150US2013078808A1Electroless deposition solutions and process controlKOLICS ARTUR·Filed 2012·Application pending·0 cites
- 1249US8518815B2Methods, devices, and materials for metallizationKOLICS ARTUR·Filed 2010·Granted Aug 27, 2013·0 cites·18 claims
- 1348US2009162681A1Activation solution for electroless plating on dielectric layersKOLICS ARTUR·Filed 2008·Application pending·0 cites
- 1442US9153449B2Electroless gap fillKOLICS ARTUR·Filed 2012·Granted Oct 6, 2015·0 cites·13 claims
- 1540US2013240484A1Electroless copper alloy cappingKOLICS ARTUR·Filed 2012·Application pending·0 cites
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