Assignee
KOZAWA MIWA
JP·11 granted patents·1 pending application·17 citations·filing 2003–2012
Top patents by PatentIndex Score
12 records- 0175US8906598B2Pattern forming method, method for manufacturing semiconductor device, and material for forming coating layer of resist patternKOZAWA MIWA·Filed 2011·Granted Dec 9, 2014·3 cites·9 claims
- 0272US8129092B2Resist pattern thickening material and process for forming resist pattern, and semiconductor device and method for manufacturing the sameKOZAWA MIWA·Filed 2006·Granted Mar 6, 2012·3 cites·2 claims
- 0372US8119325B2Method for forming resist pattern, semiconductor device and production method thereofKOZAWA MIWA·Filed 2006·Granted Feb 21, 2012·3 cites·10 claims
- 0470US8795949B2Resist pattern improving material, method for forming resist pattern, and method for producing semiconductor deviceKOZAWA MIWA·Filed 2011·Granted Aug 5, 2014·2 cites·19 claims
- 0566US8198014B2Resist cover film forming material, resist pattern forming method, and electronic device and method for manufacturing the sameKOZAWA MIWA·Filed 2007·Granted Jun 12, 2012·2 cites·13 claims
- 0655US8338080B2Process for forming resist pattern, semiconductor device and fabrication thereofKOZAWA MIWA·Filed 2003·Granted Dec 25, 2012·4 cites·18 claims
- 0753US8652751B2Resist composition, method for forming resist pattern, and method for producing electronic deviceKOZAWA MIWA·Filed 2009·Granted Feb 18, 2014·0 cites·13 claims
- 0852US8198009B2Resist pattern thickening material and process for forming resist pattern, and semiconductor device and process for producing the sameKOZAWA MIWA·Filed 2010·Granted Jun 12, 2012·0 cites·22 claims
- 0949US8945816B2Method for forming resist pattern, semiconductor device and production method thereofKOZAWA MIWA·Filed 2011·Granted Feb 3, 2015·0 cites·3 claims
- 1049US2012126372A1Resist pattern thickening material and process for forming resist pattern, and semiconductor device and method for manufacturing the sameKOZAWA MIWA·Filed 2012·Application pending·0 cites
- 1145US8980535B2Resist pattern improving material, method for forming resist pattern, and method for producing semiconductor deviceKOZAWA MIWA·Filed 2011·Granted Mar 17, 2015·0 cites·4 claims
- 1237US8476346B2Resist pattern thickening material, semiconductor device, and production method thereofKOZAWA MIWA·Filed 2010·Granted Jul 2, 2013·0 cites·12 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →