Assignee
KWON HEUNGKYU
KR·3 granted patents·2 pending applications·21 citations·filing 2012–2014
Top patents by PatentIndex Score
5 records- 0190US9606591B2Surface temperature management method of mobile device and memory thermal management method of multichip packageKWON HEUNGKYU·Filed 2012·Granted Mar 28, 2017·16 cites·7 claims
- 0273US9214441B2Semiconductor package including stacked memory chipsKWON HEUNGKYU·Filed 2014·Granted Dec 15, 2015·4 cites·20 claims
- 0356US9390992B2Semiconductor packages including a metal layer between first and second semiconductor chipsKWON HEUNGKYU·Filed 2014·Granted Jul 12, 2016·1 cites·20 claims
- 0445US2012299197A1Semiconductor packagesKWON HEUNGKYU·Filed 2012·Application pending·0 cites
- 0542US2014374900A1Semiconductor package and method of fabricating the sameKWON HEUNGKYU·Filed 2014·Application pending·0 cites
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