Semiconductor packages

Abstract

Semiconductor packages include a first substrate including a central portion and a peripheral portion, at least one first central connection member attached to the central portion of the first substrate, and at least one first peripheral connection member attached to the peripheral portion of the first substrate. The first central connection member includes a first supporter and a first fusion conductive layer surrounding the first supporter.

1 . A semiconductor package comprising:
 a first substrate including a central portion and a peripheral portion;   at least one first central connection member attached to the central portion of the first substrate; and   at least one first peripheral connection member attached to the peripheral portion of the first substrate,   wherein the first central connection member includes a first supporter and a first fusion conductive layer surrounding the first supporter.   
     
     
         2 . The semiconductor package of  claim 1 , wherein the first peripheral connection member does not include the first supporter. 
     
     
         3 . The semiconductor package of  claim 1 , wherein the at least one first peripheral connection member includes two or more first peripheral connection members, and
 wherein a distance between the first central connection member and the first peripheral connection member directly adjacent to each other is equal to or greater than a distance between the first peripheral connection members directly adjacent to each other.   
     
     
         4 . The semiconductor package of  claim 1 , further comprising at least one first semiconductor chip mounted on the first substrate,
 wherein the at least one first central connection member and the at least one first peripheral connection member are disposed between the first substrate and the first semiconductor chip.   
     
     
         5 . The semiconductor package of  claim 1 , further comprising:
 at least one first semiconductor chip mounted on the first substrate; and   a second substrate disposed under the first substrate,   wherein the at least one first central connection member and the at least one first peripheral connection member are disposed between the first substrate and the second substrate.   
     
     
         6 . The semiconductor package of  claim 5 , wherein the central portion has a square shape, a circular shape or a cross shape in a plan view. 
     
     
         7 . The semiconductor package of  claim 5 , further comprising:
 at least one second semiconductor chip mounted on the second substrate; and   at least one second central connection members and at least one second peripheral connection members disposed between the second substrate and the second semiconductor chip,   wherein the second central connection member includes a second supporter and a second fusion conductive layer surrounding the second supporter.   
     
     
         8 . The semiconductor package of  claim 7 , wherein the second substrate includes a recessed region, and
 wherein the second semiconductor chip is disposed in the recessed region.   
     
     
         9 . The semiconductor package of  claim 7 , wherein a height of the first central connection member is different from a height of the second central connection member. 
     
     
         10 . The semiconductor package of  claim 1 , wherein the first supporter includes a polymer material, and
 wherein the first central connection member further includes a first adhesive layer between the first supporter and the first fusion conductive layer.   
     
     
         11 . The semiconductor package of  claim 10 , wherein the first supporter has a sphere shape, a cylinder shape, a regular hexahedron shape or a hexahedron shape. 
     
     
         12 . The semiconductor package of  claim 1 , wherein a height of the first central connection member is equal to a height of the first peripheral connection member. 
     
     
         13 . The semiconductor package of  claim 10 , wherein the first central connection member further includes a second adhesive layer between the first adhesive layer and the first fusion conductive layer. 
     
     
         14 . The semiconductor package of  claim 1 , further comprising:
 at least one first semiconductor chip mounted on the first substrate; and   a motherboard disposed under the first substrate,   wherein the at least one first central connection member and the at least one first peripheral connection member are disposed between the first substrate and the motherboard.   
     
     
         15 . The semiconductor package of  claim 1 , wherein the first central connection member and the first peripheral connection member are attached to a bottom surface of the first substrate, and
 wherein a distance between the first central connection member and the first peripheral connection member directly adjacent to each other is substantially equal to a distance between the first peripheral connection members directly adjacent to each other.   
     
     
         16 - 20 . (canceled)