Inventor · disambiguated record
Heungkyu Kwon
Also filed as: KWON HEUNGKYU
21 granted patents·7 pending applications·81 citations·filing 2010–2024
93Inventor score
Top patents by PatentIndex Score
28 records- 0194US10198049B2Surface temperature management method of mobile device and memory thermal management method of multichip packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Feb 5, 2019·9 cites·18 claims
- 0292US11075138B2Semiconductor package systemSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jul 27, 2021·7 cites·20 claims
- 0392US9698088B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jul 4, 2017·11 cites·19 claims
- 0490US9606591B2Surface temperature management method of mobile device and memory thermal management method of multichip packageKWON HEUNGKYU·Filed 2012·Granted Mar 28, 2017·16 cites·7 claims
- 0585US12167312B2Electronic device and operating methodSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 10, 2024·2 cites·20 claims
- 0680US8981543B2Semiconductor package and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Mar 17, 2015·7 cites·17 claims
- 0780US8426959B2Semiconductor package and method of manufacturing the samePARK JI-HYUN·Filed 2010·Granted Apr 23, 2013·5 cites·29 claims
- 0879US8709879B2Method of forming a semiconductor packagePARK JI-HYUN·Filed 2013·Granted Apr 29, 2014·4 cites·12 claims
- 0976US8952517B2Package-on-package device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Feb 10, 2015·7 cites·9 claims
- 1075US11069623B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jul 20, 2021·2 cites·16 claims
- 1174US10068881B2Package-on-package type semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Sep 4, 2018·2 cites·19 claims
- 1273US9214441B2Semiconductor package including stacked memory chipsKWON HEUNGKYU·Filed 2014·Granted Dec 15, 2015·4 cites·20 claims
- 1372US9859237B2Chip using triple pad configuration and packaging method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jan 2, 2018·3 cites·25 claims
- 1471US10991638B2Semiconductor package systemSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Apr 27, 2021·1 cites·19 claims
- 1563US12406899B2Semiconductor package systemSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Sep 2, 2025·0 cites·20 claims
- 1663US11658090B2Semiconductor package systemSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 23, 2023·0 cites·20 claims
- 1761US2025157958A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1858US2025157867A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1957US2025167135A1Semiconductor package including a stiffenerSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2056US11908758B2Semiconductor package including dual stiffenerSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 20, 2024·0 cites·18 claims
- 2156US9390992B2Semiconductor packages including a metal layer between first and second semiconductor chipsKWON HEUNGKYU·Filed 2014·Granted Jul 12, 2016·1 cites·20 claims
- 2254US11600607B2Semiconductor module including multiple power management semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Mar 7, 2023·0 cites·20 claims
- 2353US11908810B2Hybrid semiconductor device and electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 20, 2024·0 cites·20 claims
- 2448US11244885B2Semiconductor package systemSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 8, 2022·0 cites·19 claims
- 2546US2023050969A1Package-on-package and package module including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 2645US2012299197A1Semiconductor packagesKWON HEUNGKYU·Filed 2012·Application pending·0 cites
- 2742US2014374900A1Semiconductor package and method of fabricating the sameKWON HEUNGKYU·Filed 2014·Application pending·0 cites
- 2834US2012074595A1Semiconductor packageHA JEONGOH·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →