Inventor · disambiguated record
Kang Joon Lee
Also filed as: LEE KANG JOON
4 granted patents·5 pending applications·16 citations·filing 2011–2024
68Inventor score
Top patents by PatentIndex Score
9 records- 0192US9698088B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jul 4, 2017·11 cites·19 claims
- 0271US9478523B2Semiconductor packages and methods of fabricating the sameLEE KANG JOON·Filed 2015·Granted Oct 25, 2016·4 cites·13 claims
- 0359US2025062264A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0456US2024145295A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0555US2025062244A1Semiconductor package and wiring substrate included in the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0654US9786644B2Methods of fabricating a semiconductor packageSHI HONGBIN·Filed 2016·Granted Oct 10, 2017·1 cites·20 claims
- 0745US2012299197A1Semiconductor packagesKWON HEUNGKYU·Filed 2012·Application pending·0 cites
- 0836US9728516B2Electric apparatus including electric patterns for suppressing solder bridgesSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Aug 8, 2017·0 cites·18 claims
- 0922US2011259914A1Dual-structure tube vessel and method of producing the sameLEE KANG JOON·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →