Inventor · disambiguated record
Su-Chang Lee
Also filed as: LEE SU-CHANG
13 granted patents·6 pending applications·92 citations·filing 2007–2025
91Inventor score
Top patents by PatentIndex Score
19 records- 0194US8604614B2Semiconductor packages having warpage compensationKWON HEUNG-KYU·Filed 2011·Granted Dec 10, 2013·19 cites·17 claims
- 0293US11646275B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 9, 2023·2 cites·17 claims
- 0393US10651133B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted May 12, 2020·8 cites·12 claims
- 0492US9698088B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jul 4, 2017·11 cites·19 claims
- 0592US8546954B2Stacked semiconductor package having electrical connections or varying heights between substrates, and semiconductor device including the stacked semiconductor packageKWON HEUNG-KYU·Filed 2011·Granted Oct 1, 2013·13 cites·33 claims
- 0689US8716872B2Stacked semiconductor package including connections electrically connecting first and second semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted May 6, 2014·8 cites·19 claims
- 0786US9048168B2Semiconductor packages having warpage compensationSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jun 2, 2015·7 cites·20 claims
- 0886US7868443B2Vertical stack type multi-chip package having improved grounding performance and lower semiconductor chip reliabilitySAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Jan 11, 2011·11 cites·20 claims
- 0981US11088091B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 10, 2021·1 cites·20 claims
- 1079US12132009B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 29, 2024·0 cites·19 claims
- 1179US9040351B2Stack packages having fastening element and halogen-free inter-package connectorSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted May 26, 2015·4 cites·20 claims
- 1279US7615415B2Vertical stack type multi-chip package having improved grounding performance and lower semiconductor chip reliabilitySAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Nov 10, 2009·7 cites·15 claims
- 1364US9601458B2Stacked semiconductor package including connections electrically connecting first and second semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Mar 21, 2017·1 cites·20 claims
- 1464US2025337454A1Method and apparatus for controlling communication signal of photovoltaic power generation systemHANWHA SOLUTIONS CORP·Filed 2025·Application pending·0 cites
- 1559US2025264549A1Method and apparatus for fault detecting of inverterHANWHA SOLUTIONS CORP·Filed 2024·Application pending·0 cites
- 1656US2025266203A1Transformer core, power converter including the transformer core, and solar module including the sameHANWHA SOLUTIONS CORP·Filed 2024·Application pending·0 cites
- 1750US2024290750A1Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1847US2012280404A1Stack packages having fastening element and halogen-free inter-package connectorKWON HEUNG-KYU·Filed 2012·Application pending·0 cites
- 1945US2012299197A1Semiconductor packagesKWON HEUNGKYU·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →