Assignee
LEE WEN-YI
TW·1 granted patent·3 pending applications·11 citations·filing 2009–2018
Top patents by PatentIndex Score
4 records- 0186US10346735B1Assembling buckle structure for memory circuit boardLEE WEN YI·Filed 2018·Granted Jul 9, 2019·11 cites·13 claims
- 0241US2011088870A1Memory Heatsink Set With Supplementary Retaining DevicesLEE WEN-YI·Filed 2009·Application pending·0 cites
- 0341US2011002103A1Interlocking Structure For Memory Heat SinkLEE WEN-YI·Filed 2009·Application pending·0 cites
- 0441US2010276134A1Heat Sink for a RAMLEE WEN-YI·Filed 2009·Application pending·0 cites
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