US2011088870A1PendingUtilityA1

Memory Heatsink Set With Supplementary Retaining Devices

41
Assignee: LEE WEN-YIPriority: Oct 16, 2009Filed: Oct 16, 2009Published: Apr 21, 2011
Est. expiryOct 16, 2029(~3.3 yrs left)· nominal 20-yr term from priority
Inventors:Wen-Yi Lee
H10W 40/641H10W 40/226G06F 1/20
41
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Claims

Abstract

A memory heatsink set for dissipating heat from a memory module is disclosed to include a first memory heatsink and a second memory heatsink, two guide devices bilaterally provided between the first memory heatsink and the second memory heatsink for positioning during the assembly process of the memory heatsink set and for guiding the first memory heatsink and the second memory heatsink into alignment, and two supplementary retaining devices respectively provided at two ends between the first memory heatsink and the second memory heatsink, each supplementary retaining device having a main engagement opening and two lateral sub-engagement openings located on one end of the first memory heatsink and a main engagement block and two lateral sub-engagement blocks located on the corresponding end of the second memory heatsink for engaging the main engagement opening and the two lateral sub-engagement openings respectively.

Claims

exact text as granted — not AI-modified
1 . A memory heatsink set with supplementary retaining devices, comprising:
 a first memory heatsink and a second memory heatsink, said first memory heatsink and said second memory heatsink being narrow elongated strip members, each having a top bearing flange perpendicularly extended from a top side thereof;   at least one guide device provided between the top bearing flanges of said first memory heatsink and said second memory heatsink for positioning during the assembly process of the memory heatsink set and for guiding said first memory heatsink and said second memory heatsink into alignment;   two supplementary retaining devices respectively provided at two ends between said first memory heatsink and said second memory heatsink, each said supplementary retaining device comprising first engagement means and second engagement means respectively located on one end of said first memory heatsink and one corresponding end of said second memory heatsink for supporting a memory module in between said first memory heatsink and said second memory heatsink, said first engagement means comprising a main engagement opening and at least one sub-engagement opening arranged in a parallel manner at the free end thereof, said main engagement opening having a relatively narrower outer end and a relatively wider inner end, said second engagement means comprising a main engagement block and at least one sub-engagement block disposed arranged in a parallel manner at the free end thereof for engaging the main engagement opening and at least one sub-engagement opening of said first engagement means respectively, said main engagement block having a relatively thicker outer end and a relatively thinner inner end.   
     
     
         2 . The memory heatsink set with supplementary retaining devices as claimed in  claim 1 , wherein said first engagement means further comprises a spacer block disposed between said main engagement opening and each said sub-engagement opening, said spacer block having a recessed portion at a root thereof; each said sub-engagement block of said second engagement means has a configuration fitting the associating sub-engagement opening and a root expanding in direction toward said main engagement block. 
     
     
         3 . The memory heatsink set with supplementary retaining devices as claimed in  claim 1 , wherein said first engagement means further comprises a locating groove disposed in each said sub-engagement opening; each said sub-engagement block has a locating protrusion for engaging the locating groove in the respective sub-engagement opening. 
     
     
         4 . The memory heatsink set with supplementary retaining devices as claimed in  claim 2 , wherein said first engagement means further comprises a locating groove disposed in each said sub-engagement opening; each said sub-engagement block has a locating protrusion for engaging the locating groove in the respective sub-engagement opening. 
     
     
         5 . The memory heatsink set with supplementary retaining devices as claimed in  claim 1 , wherein each said guide device comprises first retaining means and second retaining means respectively located on the top bearing flange of said first memory heatsink and the top bearing flange of said second memory heatsink for engagement with each other to prohibit displacement between said first memory heatsink and said second memory heatsink in left-right direction and to hold said first memory heatsink and said second memory heatsink in alignment. 
     
     
         6 . The memory heatsink set with supplementary retaining devices as claimed in  claim 2 , wherein each said guide device comprises first retaining means and second retaining means respectively located on the top bearing flange of said first memory heatsink and the top bearing flange of said second memory heatsink for engagement with each other to prohibit displacement between said first memory heatsink and said second memory heatsink in left-right direction and to hold said first memory heatsink and said second memory heatsink in alignment. 
     
     
         7 . The memory heatsink set with supplementary retaining devices as claimed in  claim 5 , wherein said first retaining means comprises a first retaining block protruded from the top bearing flange of one of said first memory heatsink and said second retaining means, and said second retaining means comprises two second retaining blocks protruded from the top bearing flange of the other of said first memory heatsink and said second memory heatsink and defining therebetween a space for the engagement of said first retaining block. 
     
     
         8 . The memory heatsink set with supplementary retaining devices as claimed in  claim 6 , wherein said first retaining means comprises a first retaining block protruded from the top bearing flange of one of said first memory heatsink and said second retaining means, and said second retaining means comprises two second retaining blocks protruded from the top bearing flange of the other of said first memory heatsink and said second memory heatsink and defining therebetween a space for the engagement of said first retaining block.

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