Assignee
LIM CHANG HYUN
KR·5 granted patents·4 pending applications·7 citations·filing 2009–2012
Top patents by PatentIndex Score
9 records- 0176US8664755B2Power module package and method for manufacturing the sameLIM CHANG HYUN·Filed 2011·Granted Mar 4, 2014·4 cites·21 claims
- 0265US8315056B2Heat-radiating substrate and method of manufacturing the sameLIM CHANG HYUN·Filed 2010·Granted Nov 20, 2012·1 cites·10 claims
- 0362US8603842B2Method of manufacturing package substrate for optical elementLIM CHANG HYUN·Filed 2012·Granted Dec 10, 2013·1 cites·8 claims
- 0460US8558359B2Semiconductor package having lead framesLIM CHANG HYUN·Filed 2012·Granted Oct 15, 2013·1 cites·18 claims
- 0557US8686295B2Heat-dissipating substrate and fabricating method thereofLIM CHANG HYUN·Filed 2009·Granted Apr 1, 2014·0 cites·9 claims
- 0650US2011088928A1Heat dissipating substrateLIM CHANG HYUN·Filed 2009·Application pending·0 cites
- 0749US2011303440A1Hybrid heat-radiating substrate and method of manufacturing the sameLIM CHANG HYUN·Filed 2010·Application pending·0 cites
- 0844US2011140144A1Package substrate for optical element and method of manufacturing the sameLIM CHANG HYUN·Filed 2010·Application pending·0 cites
- 0941US2011303437A1Heat-radiating substrate and method of manufacturing the sameLIM CHANG HYUN·Filed 2010·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →