Package substrate for optical element and method of manufacturing the same

Abstract

Disclosed is a package substrate for an optical element, which includes a base substrate, a first circuit layer formed on the base substrate and including a mounting portion, an optical element mounted on the mounting portion, one or more trenches formed into a predetermined pattern around the mounting portion by removing portions of the first circuit layer so that the first circuit layer and the optical element are electrically connected to each other, and a fluorescent resin material applied on an area defined by the trenches so as to cover the optical element, and in which such trenches are formed on the first circuit layer so that the optical element and the first circuit layer are electrically connected to each other, thus maintaining the shape of the fluorescent resin material and obviating the need to form a via under the optical element. A method of manufacturing the package substrate for an optical element is also provided.

1 . A package substrate for an optical element, comprising:
 a base substrate;   a first circuit layer formed on the base substrate and including a mounting portion;   an optical element mounted on the mounting portion;   one or more trenches formed into a predetermined pattern around the mounting portion by removing portions of the first circuit layer so that the first circuit layer and the optical element are electrically connected to each other; and   a fluorescent resin material applied on an area defined by the trenches so as to cover the optical element.   
     
     
         2 . The package substrate as set forth in  claim 1 , wherein the predetermined pattern has a circular shape, an oval shape or a polygonal shape. 
     
     
         3 . The package substrate as set forth in  claim 1 , wherein the trenches are formed by removing portions of the first circuit layer using etching. 
     
     
         4 . The package substrate as set forth in  claim 1 , wherein the base substrate is an organic substrate or a metal substrate having an anodic oxide film formed over an entire surface of the metal substrate. 
     
     
         5 . The package substrate as set forth in  claim 1 , wherein the base substrate is an aluminum substrate having alumina formed over an entire surface of the aluminum substrate. 
     
     
         6 . The package substrate as set forth in  claim 1 , further comprising a second circuit layer spaced apart from the first circuit layer on the base substrate. 
     
     
         7 . The package substrate as set forth in  claim 6 , further comprising a wiring for electrically connecting the second circuit layer and the optical element to each other. 
     
     
         8 . A method of manufacturing a package substrate for an optical element, comprising:
 (A) forming a first circuit layer including a mounting portion on a base substrate;   (B) removing portions of the first circuit layer thus forming one or more trenches into a predetermined pattern around the mounting portion so that the first circuit layer and an optical element which will be mounted on the mounting portion are electrically connected to each other;   (C) mounting the optical element on the mounting portion; and   (D) applying a fluorescent resin material on an area defined by the trenches so as to cover the optical element.   
     
     
         9 . The method as set forth in  claim 8 , wherein in (B) the predetermined pattern has a circular shape, an oval shape, or a polygonal shape. 
     
     
         10 . The method as set forth in  claim 8 , wherein in (B) the trenches are formed by removing portions of the first circuit layer using etching. 
     
     
         11 . The method as set forth in  claim 8 , wherein in (A) the base substrate is an organic substrate. 
     
     
         12 . The method as set forth in  claim 8 , further comprising preparing as the base substrate a metal substrate having an anodic oxide film formed over an entire surface thereof, before (A). 
     
     
         13 . The method as set forth in  claim 8 , further comprising preparing as the base substrate an aluminum substrate having alumina formed over an entire surface thereof, before (A). 
     
     
         14 . The method as set forth in  claim 8 , wherein (A) further comprises forming a second circuit layer spaced apart from the first circuit layer on the base substrate. 
     
     
         15 . The method as set forth in  claim 14 , further comprising electrically connecting the second circuit layer and the optical element to each other using a wiring, after (C). 
     
     
         16 . The method as set forth in  claim 8 , wherein (A) further comprises forming a seed layer on the base substrate before forming the first circuit layer.