Assignee
LIN CHIA-YU
TW·4 granted patents·3 pending applications·8 citations·filing 2009–2012
Top patents by PatentIndex Score
7 records- 0170US9431271B2Heat dissipating deviceLIN CHIA-YU·Filed 2012·Granted Aug 30, 2016·3 cites·1 claims
- 0267US8853919B2Ultrasonic sensor deviceLIN CHIA-YU·Filed 2012·Granted Oct 7, 2014·5 cites·9 claims
- 0357US2013180688A1Heat-dissipating module and method for manufacturing the sameLIN CHIA-YU·Filed 2012·Application pending·0 cites
- 0449US2013175007A1Heat-conducting module and method for manufacturing the sameLIN CHIA-YU·Filed 2012·Application pending·0 cites
- 0542US2013153189A1Heat dissipating fin, heat dissipating device and method of manufacturing the sameLIN CHIA-YU·Filed 2011·Application pending·0 cites
- 0641US8164981B2Ultrasonic distance-measuring sensor with gap and partition between vibrating surfacesLIN CHIA-YU·Filed 2009·Granted Apr 24, 2012·0 cites·10 claims
- 0739US8919423B2Heat dissipating deviceLIN CHIA-YU·Filed 2012·Granted Dec 30, 2014·0 cites·17 claims
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