Heat dissipating fin, heat dissipating device and method of manufacturing the same

Abstract

A heat dissipating device includes a base and a plurality of heat dissipating fins. Each of the heat dissipating fins includes a heat dissipating portion, a fixing portion and an overflow-proof structure. The fixing portion is fixed in the base. The overflow-proof structure is connected between the heat dissipating portion and the fixing portion. A width of the overflow-proof structure is larger than a width of the heat dissipating portion and larger than a width of the fixing portion.

1 . A heat dissipating fin comprising:
 a heat dissipating portion;   a fixing portion; and   an overflow-proof structure connected between the heat dissipating portion and the fixing portion;   wherein a width of the overflow-proof structure is larger than a width of the heat dissipating portion.   
     
     
         2 . The heat dissipating fin of  claim 1 , wherein a length of the overflow-proof structure protruded from the fixing portion is between 1 mm and 10 mm. 
     
     
         3 . The heat dissipating fin of  claim 1 , further comprising a recess structure formed on the fixing portion. 
     
     
         4 . The heat dissipating fin of  claim 3 , further comprising a hook structure formed in the recess structure. 
     
     
         5 . The heat dissipating fin of  claim 1 , further comprising a protruding structure protruded from one end of the fixing portion. 
     
     
         6 . The heat dissipating fin of  claim 1 , further comprising an extending structure extended from the overflow-proof structure toward the fixing portion. 
     
     
         7 . The heat dissipating fin of  claim 6 , wherein the overflow-proof structure and the extending structure are formed as U-shape. 
     
     
         8 . The heat dissipating fin of  claim 1 , wherein a thickness of the overflow-proof structure is uniform or varies gradiently. 
     
     
         9 . A heat dissipating device comprising:
 a base; and   a plurality of heat dissipating fins, each of the heat dissipating fins comprising:
 a heat dissipating portion; 
 a fixing portion fixed in the base; and 
 an overflow-proof structure connected between the heat dissipating portion and the fixing portion; 
 wherein a width of the overflow-proof structure is larger than a width of the heat dissipating portion. 
   
     
     
         10 . The heat dissipating device of  claim 9 , wherein each of the heat dissipating fins further comprises a recess structure formed on the fixing portion. 
     
     
         11 . The heat dissipating device of  claim 10 , wherein each of the heat dissipating fins further comprises a hook structure formed in the recess structure. 
     
     
         12 . The heat dissipating device of  claim 9 , wherein each of the heat dissipating fins further comprises a protruding structure protruded from one end of the fixing portion. 
     
     
         13 . The heat dissipating device of  claim 9 , wherein each of the heat dissipating fins further comprises an extending structure extended from the overflow-proof structure toward the fixing portion. 
     
     
         14 . The heat dissipating device of  claim 13 , wherein the overflow-proof structure and the extending structure are formed as U-shape. 
     
     
         15 . The heat dissipating device of  claim 9 , wherein a thickness of the overflow-proof structure is uniform or varies gradiently. 
     
     
         16 . A method of manufacturing a heat dissipating device comprising:
 forming a plurality of heat dissipating fins by a forming process, wherein each of the heat dissipating fins comprises a heat dissipating portion, a fixing portion and an overflow-proof structure, the overflow-proof structure is connected between the heat dissipating portion and the fixing portion, a width of the overflow-proof structure is larger than a width of the heat dissipating portion;   putting the fixing portion of each of the heat dissipating fins into a mold;   pouring a melt metal material into the mold; and   processing the melt metal material by a die casting process so as to form a base, wherein the base covers the fixing portion of each of the heat dissipating fins and the overflow-proof structure of each of the heat dissipating fins prevents the melt metal material from overflowing.   
     
     
         17 . The method of  claim 16 , wherein the forming process is an aluminum extrusion process and each of the heat dissipating fins is a flat-type heat dissipating fin, or the forming process is a rivet forming process and each of the heat dissipating fins is a cylinder-type heat dissipating fin. 
     
     
         18 . The method of  claim 16 , wherein forming a plurality of heat dissipating fins by a forming process further comprises forming a recess structure on the fixing portion. 
     
     
         19 . The method of  claim 16 , wherein forming a plurality of heat dissipating fins by a forming process further comprises forming a protruding structure on the fixing portion and enabling the protruding structure to protrude from one end of the fixing portion. 
     
     
         20 . The method of  claim 16 , wherein forming a plurality of heat dissipating fins by a forming process further comprises forming an extending structure on the overflow-proof structure and enabling the extending structure to extend from the overflow-proof structure toward the fixing portion. 
     
     
         21 . The heat dissipating fin of  claim 1 , wherein the width of the overflow-proof structure is larger than a width of the fixing portion. 
     
     
         22 . The heat dissipating device of  claim 9 , wherein the width of the overflow-proof structure is larger than a width of the fixing portion. 
     
     
         23 . The method of  claim 16 , wherein the width of the overflow-proof structure is larger than a width of the fixing portion.