Inventor · disambiguated record
Chia-Yu Lin
Also filed as: LIN CHIA-YU
37 granted patents·28 pending applications·29 citations·filing 2005–2025
95Inventor score
Files withCOOLER MASTER CO LTD13LIN CHIA-YU7TAIWAN SEMICONDUCTOR MFG CO LTD7TAIWAN GLASS IND CORP5COOLER MASTER DEV CORP4
Top patents by PatentIndex Score
65 records- 0196US11692777B2Heat exchanger fin and manufacturing method of the sameCOOLER MASTER CO LTD·Filed 2022·Granted Jul 4, 2023·2 cites·11 claims
- 0292US11530879B2Heat exchanger fin and manufacturing method of tHE sameCOOLER MASTER CO LTD·Filed 2021·Granted Dec 20, 2022·2 cites·16 claims
- 0385US2025353736A1Semiconductor structure and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0484US10557504B1Linear guideway capable of detecting abnormal circulation stateHIWIN TECH CORP·Filed 2019·Granted Feb 11, 2020·3 cites·4 claims
- 0582US12054382B2Roughness selectivity for MEMS movement stiction reductionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 6, 2024·0 cites·20 claims
- 0681US10436254B1Linear guideway capable of detecting abnormal circulation stateHIWIN TECH CORP·Filed 2019·Granted Oct 8, 2019·3 cites·5 claims
- 0780US11725885B2Heat exchanger fin and manufacturing method of the sameCOOLER MASTER CO LTD·Filed 2022·Granted Aug 15, 2023·0 cites·12 claims
- 0879US10508691B1Linear guidewayHIWIN TECH CORP·Filed 2019·Granted Dec 17, 2019·3 cites·10 claims
- 0978US11598588B2Method of manufacturing a heat exchangerCOOLER MASTER CO LTD·Filed 2022·Granted Mar 7, 2023·0 cites·5 claims
- 1078US11598587B2Method of manufacturing a heat exchangerCOOLER MASTER CO LTD·Filed 2022·Granted Mar 7, 2023·0 cites·7 claims
- 1178US11402163B2Heat dissipation device and fin structureCOOLER MASTER CO LTD·Filed 2019·Granted Aug 2, 2022·2 cites·40 claims
- 1277US12454455B2Semiconductor structure and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 28, 2025·0 cites·20 claims
- 1375US12283568B2Wafer bonding alignmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 22, 2025·0 cites·20 claims
- 1474US11655138B2Roughness selectivity for MEMS movement stiction reductionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 23, 2023·0 cites·20 claims
- 1574US2025382711A1Method of preparing 2-hydroxyadpic acid and adipic acidUNIV NAT CHENG KUNG·Filed 2024·Application pending·0 cites
- 1673US11359870B2Method of manufacturing a heat exchangerCOOLER MASTER CO LTD·Filed 2021·Granted Jun 14, 2022·0 cites·4 claims
- 1773US2025246578A1Wafer bonding alignmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1873US2025052511A1Vapor chamber heatsink assemblyCOOLER MASTER CO LTD·Filed 2024·Application pending·0 cites
- 1970US10826473B2PVT-independent fixed delay circuitINTEGRATED SILICON SOLUTION INC BEIJING·Filed 2019·Granted Nov 3, 2020·4 cites·3 claims
- 2070US9431271B2Heat dissipating deviceLIN CHIA-YU·Filed 2012·Granted Aug 30, 2016·3 cites·1 claims
- 2167US11732981B2Heat dissipation deviceCOOLER MASTER CO LTD·Filed 2022·Granted Aug 22, 2023·0 cites·30 claims
- 2267US8853919B2Ultrasonic sensor deviceLIN CHIA-YU·Filed 2012·Granted Oct 7, 2014·5 cites·9 claims
- 2366US12163745B2Heat dissipation device and fin structureCOOLER MASTER CO LTD·Filed 2022·Granted Dec 10, 2024·0 cites·4 claims
- 2466US11742320B2Wafer bonding alignmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 29, 2023·0 cites·14 claims
- 2563US9347712B2Heat dissipating deviceCOOLER MASTER DEV CORP·Filed 2013·Granted May 24, 2016·2 cites·7 claims
- 2662US11828754B2Modified electrode, manufacturing method thereof and use thereofUNIV NAT CHENG KUNG·Filed 2022·Granted Nov 28, 2023·0 cites·8 claims
- 2761US11384999B2Heat dissipation deviceCOOLER MASTER CO LTD·Filed 2020·Granted Jul 12, 2022·0 cites·19 claims
- 2861US2025327762A1Composite semiconductor inspection systemNANOSEEX INC·Filed 2024·Application pending·0 cites
- 2961US2015013928A1Method for manufacturing heat-dissipating moduleCOOLER MASTER DEV CORP·Filed 2014·Application pending·0 cites
- 3057US12435432B2Bismuth-based modified electrode, manufacturing method thereof and use thereofUNIV NAT CHENG KUNG·Filed 2022·Granted Oct 7, 2025·0 cites·6 claims
- 3157US2024154215A1Aluminum plastic film for lithium battery and method for manufacturing the sameNAN YA PLASTICS CORP·Filed 2023·Application pending·0 cites
- 3257US2013180688A1Heat-dissipating module and method for manufacturing the sameLIN CHIA-YU·Filed 2012·Application pending·0 cites
- 3357US2021180873A1Vapor chamber heatsink assemblyCOOLER MASTER CO LTD·Filed 2020·Application pending·0 cites
- 3456US11713273B2Glass material with low dielectric constant and low fiberizing temperatureTAIWAN GLASS IND CORP·Filed 2021·Granted Aug 1, 2023·0 cites·38 claims
- 3555US11345629B2Glass material with low dielectric constant attributable to high weight percentage of boron trioxideTAIWAN GLASS IND CORP·Filed 2019·Granted May 31, 2022·0 cites·10 claims
- 3654US11168016B2Glass material with low viscosity and low bubble content attributable to low weight percentage of silicon dioxideTAIWAN GLASS IND CORP·Filed 2019·Granted Nov 9, 2021·0 cites·24 claims
- 3753US2022169561A1Glass composition with low thermal expansion coefficient and glass fiber made of the sameTAIWAN GLASS IND CORP·Filed 2021·Application pending·0 cites
- 3852US2010101939A1Method For Preparing Zinc Oxide Nano Rod SubstrateUNIV NAT TAIWAN·Filed 2009·Application pending·0 cites
- 3950US2010168221A1Pharmaceutical composition for treating hepatitis b virus and health food product having hepatitis b virus inhibiting effectsIND TECH RES INST·Filed 2009·Application pending·0 cites
- 4049US11099838B1Method and system for recovery for custom integrated circuitQUANTA COMP INC·Filed 2020·Granted Aug 24, 2021·0 cites·16 claims
- 4149US2013175007A1Heat-conducting module and method for manufacturing the sameLIN CHIA-YU·Filed 2012·Application pending·0 cites
- 4247US12118091B2Methods for securely updating softwareQUANTA COMP INC·Filed 2022·Granted Oct 15, 2024·0 cites·20 claims
- 4347US2015144307A1Heat dissipating device and heat dissipating finCOOLER MASTER HUI ZHOU CO LTD·Filed 2014·Application pending·0 cites
- 4446US10349558B2Method of manufacturing heat dissipating deviceCOOLER MASTER HUI ZHOU CO LTD·Filed 2017·Granted Jul 9, 2019·0 cites·5 claims
- 4545US2014345136A1Heat dissipating fin, heat dissipating device and method of manufacturing the sameCOOLER MASTER DEV CORP·Filed 2014·Application pending·0 cites
- 4645US2008157958A1Anti-theft device with triggerINVENTEC CORP·Filed 2006·Application pending·0 cites
- 4744US11500084B2Method and apparatus for performing object detection by using detection threshold values derived from adding different offset values to reference threshold valuesMEDIATEK INC·Filed 2019·Granted Nov 15, 2022·0 cites·24 claims
- 4844US2022405920A1Portable medical education device, medical education platform, and medical education methodsNATIONAL YANG MING CHIAO TUNG UNIV·Filed 2022·Application pending·0 cites
- 4942US2013123204A1Method for treating hepatitis bLEE LAIN-TZE·Filed 2013·Application pending·0 cites
- 5042US2013153189A1Heat dissipating fin, heat dissipating device and method of manufacturing the sameLIN CHIA-YU·Filed 2011·Application pending·0 cites
Showing the top 50 of 65 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →