Assignee
LU SZU WEI
TW·3 granted patents·1 pending application·26 citations·filing 2008–2012
Top patents by PatentIndex Score
4 records- 0194US9620430B2Sawing underfill in packaging processesLU SZU WEI·Filed 2012·Granted Apr 11, 2017·23 cites·19 claims
- 0268US8174129B2Silicon-based thin substrate and packaging schemesLU SZU WEI·Filed 2010·Granted May 8, 2012·2 cites·20 claims
- 0361US8704383B2Silicon-based thin substrate and packaging schemesLU SZU-WEI·Filed 2012·Granted Apr 22, 2014·1 cites·22 claims
- 0449US2008142994A1Contact Pad And Bump Pad Arrangement for High-Lead Or Lead-Free BumpsLU SZU WEI·Filed 2008·Application pending·0 cites
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