Assignee
MAKI KAZUNARI
JP·3 granted patents·4 pending applications·1 citations·filing 2006–2013
Top patents by PatentIndex Score
7 records- 0159US9212419B2Sputtering target for forming wiring film of flat panel displayMAKI KAZUNARI·Filed 2009·Granted Dec 15, 2015·1 cites·2 claims
- 0250US2016300634A1Copper alloy for electric and electronic device, copper alloy sheet for electric and electronic device, conductive component for electric and electronic device, and terminalMAKI KAZUNARI·Filed 2013·Application pending·0 cites
- 0346US2013284327A1Copper alloy for electronic device, method of producing copper alloy for electronic device, and copper alloy rolled material for electronic deviceMAKI KAZUNARI·Filed 2011·Application pending·0 cites
- 0444US8658009B2Thin film transistor having a barrier layer as a constituting layer and Cu-alloy sputtering target used for sputter film formation of the barrier layerMAKI KAZUNARI·Filed 2009·Granted Feb 25, 2014·0 cites·1 claims
- 0543US2012294754A1Copper alloy with high strength and high electrical conductivityMAKI KAZUNARI·Filed 2011·Application pending·0 cites
- 0639US2009232695A1Gold alloy wire for bonding wire having high initial bondability, high bonding reliability, high roundness of compression ball, high straightness, high resin flowability resistance, and low specific resistanceMAKI KAZUNARI·Filed 2006·Application pending·0 cites
- 0737US8624397B2Electrode layer structure for a thin-film transistor and process for manufacture thereofMAKI KAZUNARI·Filed 2010·Granted Jan 7, 2014·0 cites·20 claims
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