Gold alloy wire for bonding wire having high initial bondability, high bonding reliability, high roundness of compression ball, high straightness, high resin flowability resistance, and low specific resistance

Abstract

There are provided a gold alloy wire for a bonding wire having high initial bonding ability, high bonding reliability, high roundness of a compression ball, high straightness, high resin flowability resistance, and low specific resistance. The gold alloy wire having high initial bonding ability, high bonding reliability, high roundness of a compression ball, high straightness, high resin flowability resistance, and low specific resistance contains one or more of Pt and Pd of 500 to less than 1000 ppm in total, Ir of 1 to 100 ppm, Ca of more than 30 to 100 ppm, Eu of more than 30 to 100 ppm, Be of 0.1 to 20 ppm, if necessary, one or more of La, Ba, Sr, and Bi of 30 to 100 ppm in total, if necessary, and a balance being Au and inevitable impurities.

1 . A gold alloy wire for a bonding wire that has high initial bonding ability, high bonding reliability, high roundness of a compression ball, high straightness, high resin flowability resistance, and low specific resistance, the gold alloy wire comprising:
 a component composition comprising one or more of Pt and Pd of 500 to less than 1000 ppm in total, Ir of 1 to 100 ppm, Ca of more than 30 to 100 ppm, Eu of more than 30 to 100 ppm, and a balance being Au and inevitable impurities.   
     
     
         2 . A gold alloy wire for a bonding wire that has high initial bonding ability, high bonding reliability, high roundness of a compression ball, high straightness, high resin flowability resistance, and low specific resistance, the gold alloy wire according to  claim 1 , wherein the:
 component composition further comprises Be of 0.1 to 20 ppm.   
     
     
         3 . A gold alloy wire for a bonding wire that has high initial bonding ability, high bonding reliability, high roundness of a compression ball, high straightness, high resin flowability resistance, and low specific resistance, the gold alloy wire according to  claim 1 , wherein the:
 component composition further comprises Be of 0.1 to 20 ppm, and one or more of La, Ba, Sr, and Bi of 30 to 100 ppm in total.   
     
     
         4 . The gold alloy wire for the bonding wire that has high initial bonding ability, high bonding reliability, high roundness of a compression ball, high straightness, high resin flowability resistance, and low specific resistance according to  claim 1 , further comprising:
 Ag of 1 to 10 ppm.   
     
     
         5 . The gold alloy wire for the bonding wire that has high initial bonding ability, high bonding reliability, high roundness of a compression ball, high straightness, high resin flowability resistance, and low specific resistance according to  claim 1 ,
 wherein, when 0.2% proof strength (Pa) of the gold alloy wire for the bonding wire is σ 0.2 , Young's modulus (Pa) is E, and fracture elongation percentage is E L , the following equations are satisfied
   E≧75 GPa; 
   (σ 0.2   /E )≧2.2×10 −3 ; and 
   2%≦E L ≦10%.