Assignee
MARIMUTHU PANDI CHELVAM
SG·2 granted patents·1 pending application·95 citations·filing 2008–2010
Top patents by PatentIndex Score
3 records- 0197US8263439B2Semiconductor device and method of forming an interposer package with through silicon viasMARIMUTHU PANDI CHELVAM·Filed 2010·Granted Sep 11, 2012·91 cites·31 claims
- 0279US9029193B2Semiconductor device and method of forming an interconnect structure for 3-D devices using encapsulant for structural supportMARIMUTHU PANDI CHELVAM·Filed 2010·Granted May 12, 2015·4 cites·23 claims
- 0344US2008185737A1Integrated circuit system with pre-configured bond wire ballMARIMUTHU PANDI CHELVAM·Filed 2008·Application pending·0 cites
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