Assignee
MICRO TECHNOLOGY PARTNERS
US·6 granted patents·124 citations·filing 1992–1994
Top patents by PatentIndex Score
6 records- 0167US5280194AElectrical apparatus with a metallic layer coupled to a lower region of a substrate and metallic layer coupled to a lower region of a semiconductor deviceMICRO TECHNOLOGY PARTNERS·Filed 1992·Granted Jan 18, 1994·33 cites·13 claims
- 0259US5521420AFabricating a semiconductor with an insulative coatingMICRO TECHNOLOGY PARTNERS·Filed 1994·Granted May 28, 1996·26 cites·13 claims
- 0358US5403729AFabricating a semiconductor with an insulative coatingMICRO TECHNOLOGY PARTNERS·Filed 1992·Granted Apr 4, 1995·22 cites·12 claims
- 0450US5455187AMethod of making a semiconductor device with a metallic layer coupled to a lower region of a substrate and metallic layer coupled to a lower region of a semiconductor deviceMICRO TECHNOLOGY PARTNERS·Filed 1994·Granted Oct 3, 1995·16 cites·6 claims
- 0548US5441898AFabricating a semiconductor with an insulative coatingMICRO TECHNOLOGY PARTNERS·Filed 1994·Granted Aug 15, 1995·14 cites·9 claims
- 0646US5444009AFabricating a semiconductor with an insulative coatingMICRO TECHNOLOGY PARTNERS·Filed 1994·Granted Aug 22, 1995·13 cites·9 claims
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