Assignee
MPI CORP
TW·124 granted patents·72 pending applications·171 citations·filing 2006–2025
Top patents by PatentIndex Score
196 records- 0190US11144198B2Control method of touch display apparatusMPI CORP·Filed 2019·Granted Oct 12, 2021·7 cites·13 claims
- 0290US10119991B2Vertical probe device and supporter used in the sameMPI CORP·Filed 2015·Granted Nov 6, 2018·8 cites·3 claims
- 0388US11353501B2Wafer inspection method and wafer probing systemMPI CORP·Filed 2020·Granted Jun 7, 2022·2 cites·14 claims
- 0487US12025637B2Probe cardMPI CORP·Filed 2021·Granted Jul 2, 2024·2 cites·18 claims
- 0587US9596769B2Multilayer circuit boardMPI CORP·Filed 2015·Granted Mar 14, 2017·5 cites·11 claims
- 0687US7595651B2Cantilever-type probe card for high frequency applicationMPI CORP·Filed 2007·Granted Sep 29, 2009·24 cites·11 claims
- 0786US10070512B2Multilayer circuit boardMPI CORP·Filed 2017·Granted Sep 4, 2018·4 cites·8 claims
- 0886US7791359B2Probe for high frequency signal transmission and probe card using the sameMPI CORP·Filed 2008·Granted Sep 7, 2010·11 cites·16 claims
- 0985US2026016505A1Probe assembly, probe system, method for maintaining alignment, and semiconductor device testedMPI CORP·Filed 2025·Application pending·0 cites
- 1084US11733267B2Probe head and probe cardMPI CORP·Filed 2020·Granted Aug 22, 2023·2 cites·8 claims
- 1183US11619656B2Probe head and die set having horizontally fine adjustable die and probe head adjusting methodMPI CORP·Filed 2021·Granted Apr 4, 2023·1 cites·18 claims
- 1283US2025341544A1Probe card, method for designing probe card, connection carrier boaed, method for producing tested semiconductor device, method for testing unpackaged semiconductor by probe card, device under test and probe systemMPI CORP·Filed 2025·Application pending·0 cites
- 1383US2026063669A1Probe unit, probe head, probe card, probe system, method of performing a test on an electronic device under test, and tested electronic deviceMPI CORP·Filed 2025·Application pending·0 cites
- 1482US10041974B2Probe head of vertical probe cardMPI CORP·Filed 2016·Granted Aug 7, 2018·5 cites·7 claims
- 1582US9618536B2Probe needle and probe module using the sameMPI CORP·Filed 2014·Granted Apr 11, 2017·5 cites·8 claims
- 1682US2025172589A1Probe system, probe card, probe head, and probe for testing electronic device under test integrated on a semiconductor wafer, and electronic device under test tested by the probe cardMPI CORP·Filed 2024·Application pending·0 cites
- 1782US2025147072A1Probe card, probe head, method for manufacturing the probe head, and electronic device under test tested by the probe cardMPI CORP·Filed 2024·Application pending·0 cites
- 1881US10655893B2Cooling system capable of defrostingMPI CORP·Filed 2016·Granted May 19, 2020·4 cites·4 claims
- 1980US9316685B2Probe card of low power lossMPI CORP·Filed 2013·Granted Apr 19, 2016·4 cites·16 claims
- 2080US2026092952A1Probe system, probe card, probe head, and probe for testing electronic device under test integrated on a semiconductor wafer, and electronic device tested by the probe cardMPI CORP·Filed 2025·Application pending·0 cites
- 2180US2024393368A1Probe system for testing of devices under test integrated on a semiconductor wafer, and probe card, probe head, and guiding plate structure thereinMPI CORP·Filed 2024·Application pending·0 cites
- 2280US2024393367A1Probe system for testing of devices under test integrated on a semiconductor wafer, and probe card, probe head, and guiding plate structure thereinMPI CORP·Filed 2024·Application pending·0 cites
- 2379US10436818B2Probe module having cantilever MEMS probe and method of making the sameMPI CORP·Filed 2017·Granted Oct 8, 2019·2 cites·14 claims
- 2479US10295567B2Probe module supporting loopback testMPI CORP·Filed 2016·Granted May 21, 2019·2 cites·6 claims
- 2579US9506949B2Spring probeMPI CORP·Filed 2015·Granted Nov 29, 2016·2 cites·14 claims
- 2679US7683645B2High-frequency probe card and transmission line for high-frequency probe cardMPI CORP·Filed 2006·Granted Mar 23, 2010·11 cites·21 claims
- 2778US2026016502A1Tip length calibration device and probe system including the same, tested semiconductor device and method for producing the same, method for tip length calibration, and method for testing unpackaged semiconductor deviceMPI CORP·Filed 2025·Application pending·0 cites
- 2877US12480976B2Probe card and manufacturing method thereofMPI CORP·Filed 2023·Granted Nov 25, 2025·0 cites·11 claims
- 2977US7579857B2Electrical contact device of probe cardMPI CORP·Filed 2006·Granted Aug 25, 2009·5 cites·26 claims
- 3077US2026009822A1Probe card for loopback test, probe head thereof, probe system, testing method and tested deviceMPI CORP·Filed 2025·Application pending·0 cites
- 3176US11150269B2Probe head for high frequency signal test and medium or low frequency signal test at the same timeMPI CORP·Filed 2020·Granted Oct 19, 2021·1 cites·18 claims
- 3276US9470715B2Probe headMPI CORP·Filed 2014·Granted Oct 18, 2016·4 cites·20 claims
- 3376US2026043844A1Temperature controlled test system and manifold thereof, method of distributing working fluid using manifold, and tested device under test and method of producing the sameMPI CORP·Filed 2025·Application pending·0 cites
- 3476US2026056235A1Contact probe for probe head of probe card in apparatus for testing electronic device, probe head, probe card, tested device, and method of manufacturing contact probeMPI CORP·Filed 2025·Application pending·0 cites
- 3575US9157929B2Apparatus for probing die electricity and method for forming the sameMPI CORP·Filed 2012·Granted Oct 13, 2015·3 cites·14 claims
- 3675US2025044350A1Method of determining probing parameters for probe system to test device under test, probe system and method of operating the same, non-transitory computer-readable storage media, method of testing unpackaged semiconductor device, tested semiconductor device and method of producing the same, and method of generating virtual mark imageMPI CORP·Filed 2024·Application pending·0 cites
- 3774USD922396SDisplay screen or portion thereof with graphical user interfaceMPI CORP·Filed 2018·Granted Jun 15, 2021·16 cites·1 claims
- 3874US2025044346A1Wafer probe station and method for establishing an evaluation model for calibration of a probe assemblyMPI CORP·Filed 2024·Application pending·0 cites
- 3974US2025044349A1Wafer probe station and method for establishing an evaluation model for calibration of a probe assemblyMPI CORP·Filed 2024·Application pending·0 cites
- 4073US12392803B2Probe card, method for designing probe card, method for producing tested semiconductor device method for testing unpackaged semiconductor by probe card, device under test and probe systemMPI CORP·Filed 2023·Granted Aug 19, 2025·0 cites·20 claims
- 4172US11036390B2Display method of display apparatusMPI CORP·Filed 2019·Granted Jun 15, 2021·1 cites·8 claims
- 4271US9201098B2High frequency probe cardMPI CORP·Filed 2013·Granted Dec 1, 2015·3 cites·20 claims
- 4371US2026023099A1Test system and method for performing high-voltage testing on a device under testMPI CORP·Filed 2025·Application pending·0 cites
- 4470US9823272B2Wafer testing probe cardMPI CORP·Filed 2014·Granted Nov 21, 2017·3 cites·16 claims
- 4570US9442134B2Signal path switch and probe card having the signal path switchMPI CORP·Filed 2014·Granted Sep 13, 2016·2 cites·9 claims
- 4669US11874313B2Probe card and manufacturing method thereofMPI CORP·Filed 2021·Granted Jan 16, 2024·0 cites·11 claims
- 4769US10281488B2Probe card having replaceable probe module and assembling method and probe module replacing method of the sameMPI CORP·Filed 2017·Granted May 7, 2019·2 cites·12 claims
- 4869US10161995B2Temperature control system and method thereofMPI CORP·Filed 2016·Granted Dec 25, 2018·2 cites·15 claims
- 4969US9958477B2Testing machine and operation method thereofMPI CORP·Filed 2016·Granted May 1, 2018·2 cites·14 claims
- 5069US9377214B2Heating device using photodetector to detect temperature and method for protecting the sameMPI CORP·Filed 2014·Granted Jun 28, 2016·5 cites·18 claims
Showing the top 50 of 196 patent records by PatentIndex Score.
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