Wafer inspection method and wafer probing system

Abstract

A wafer inspection method, wherein a motorized chuck stage is controlled by a control rod to be displaced between an upper position and a lower position along Z-axis direction, to change a relative position of a wafer on the motorized chuck stage relative to a probe. The control rod is movable between an upper and an lower limit positions. The wafer inspection method includes: determining a position of the control rod based on a measurement signal; determining a first moving direction and a moving distance of the control rod based on a change of the measurement signal; generating a control signal based on the moving distance of the control rod; controlling the motorized chuck stage to be displaced along a second moving direction opposite to the first moving direction; and controlling an objective lens module to keep focusing on the wafer when the motorized chuck stage is on the move.

What is claimed is: 
     
       1. A wafer inspection method, wherein a motorized chuck stage is controlled by a control rod to be displaced between an upper position and a lower position of an adjustment range along a Z-axis direction, to change a relative position of a wafer on the motorized chuck stage relative to a probe, and the control rod is capable of being moved between an upper limit position and a lower limit position in a displacement range by a user, wherein the motorized chuck stage and a tip of the probe are disposed inside of a case and the control rod is disposed outside of the case, the wafer inspection method comprising:
 determining a position of the control rod in the displacement range based on a measurement signal; 
 determining a first moving direction of the control rod and a moving distance of the control rod based on a change of the measurement signal; 
 generating a control signal based on the moving distance corresponding to the position of the control rod; 
 controlling, based on the control signal, the motorized chuck stage to be displaced along a second moving direction opposite to the first moving direction of the control rod; and 
 controlling, based on the control signal or a displacement of the motorized chuck stage, an objective lens module to keep focusing on the wafer when the motorized chuck stage is on the move so as to obtain a clear image 
 wherein the objective lens module is disposed between a camera stage and the motorized chuck stage, and the objective lens module is optically coupled to the camera stage. 
 
     
     
       2. The wafer inspection method according to  claim 1 , wherein the control rod is a virtual control rod movable between an upper position and a lower position displayed on a touch display screen. 
     
     
       3. The wafer inspection method according to  claim 1 , further comprising:
 displaying a current distance between a probe platen and the motorized chuck stage on a display screen. 
 
     
     
       4. The wafer inspection method according to  claim 1 , further comprising:
 detecting a current position of the control rod; and 
 displaying a current position information of the motorized chuck stage on a display screen. 
 
     
     
       5. The wafer inspection method according to  claim 1 , wherein the objective lens module is driven synchronously with movement of the motorized chuck stage. 
     
     
       6. The wafer inspection method according to  claim 1 , wherein both the probe and a probe platen are static, the wafer inspection method further comprising:
 displaying, based on a relative position of the control rod, a displacement information of the motorized chuck stage relative to its origin position on a display screen. 
 
     
     
       7. A wafer probing system, comprising:
 a case; 
 a motorized chuck stage, disposed inside of the case and adapted to support a wafer; 
 a probe, disposed on a probe platen above the motorized chuck stage and fixed on the case through the probe platen, wherein a tip of the probe is located inside of the case; 
 a camera stage, configured to take a picture of the wafer supported on the motorized chuck stage; 
 an objective lens module, disposed between the camera stage and the motorized chuck stage, optically coupled to the camera stage and connected to a micro motor, the objective lens module is adapted to keep focusing on the wafer when the motorized chuck stage is on the move; 
 a control rod, disposed outside of the case and capable of being moved between an upper limit position and a lower limit position by a user, and the control rod electrically connects with the controller; 
 a sensor, communicatively coupled to the control rod, when the position of the control rod is changed, the sensor generates a control signal; 
 a controller, communicatively coupled to the motorized chuck stage, the camera stage, the control rod, the micro motor and the sensor, the controller is configured to control, based on the control signal, the motorized chuck stage to move along a Z-axis direction, and the lens module to keep focusing on the wafer when the motorized chuck stage is on the move so as to obtain a clear image; and 
 a display screen, communicatively coupled to the camera stage, and the display screen includes a user interface, the user interface is adapted to show a current image of the wafer when the motorized chuck stage is on the move. 
 
     
     
       8. A wafer inspection method, wherein a first element is controlled by a second element to be displaced between an upper position and a lower position of an adjustment range along a Z-axis direction, to change a relative position of a wafer relative to a probe disposed on a probe platen, and the second element is capable of being moved between an upper limit position and a lower limit position in a displacement range by a user, the wafer inspection method comprising:
 determining a position of the second element in the displacement range based on a measurement signal; 
 determining a first moving direction of the second element based on a change of the measurement signal; 
 generating a control signal based on the first moving direction of the second element; 
 controlling, based on the control signal, the first element to be moved along a second moving direction opposite to the first moving direction of the second element; and 
 controlling, based on the control signal or a displacement of the first element, a lens module of a camera to keep focusing on the wafer when the first element is on the move so as to obtain a clear image. 
 
     
     
       9. The wafer inspection method according to  claim 8 , wherein the first element is a motorized chuck stage. 
     
     
       10. The wafer inspection method according to  claim 9 , wherein the second element is a virtual control rod movable between an upper position and a lower position displayed on a touch display screen. 
     
     
       11. The wafer inspection method according to  claim 8 , further comprising:
 displaying a current distance between the probe platen and the first element on a display screen. 
 
     
     
       12. The wafer inspection method according to  claim 8 , further comprising:
 detecting a current position of the second element; and 
 displaying a current distance information between the probe platen and the first element on a display screen. 
 
     
     
       13. The wafer inspection method according to  claim 8 , wherein the lens module is driven synchronously with movement of the first element. 
     
     
       14. The wafer inspection method according to  claim 8 , wherein both the probe and the probe platen are static, the wafer inspection method further comprising:
 displaying, based on a relative position of the control rod, a displacement information of the motorized chuck stage relative to its origin position on a display screen.