Assignee
MUTUAL PAK TECHNOLOGY CO LTD
TW·11 granted patents·3 pending applications·65 citations·filing 2004–2014
Top patents by PatentIndex Score
14 records- 0182US7886421B2Method for manufacturing integrated circuit device having antenna conductorsMUTUAL PAK TECHNOLOGY CO LTD·Filed 2010·Granted Feb 15, 2011·7 cites·4 claims
- 0280US7459345B2Packaging method for an electronic elementMUTUAL PAK TECHNOLOGY CO LTD·Filed 2004·Granted Dec 2, 2008·31 cites·10 claims
- 0380US7273768B2Wafer-level package and IC module assembly method for the wafer-level packageMUTUAL PAK TECHNOLOGY CO LTD·Filed 2005·Granted Sep 25, 2007·11 cites·6 claims
- 0478US7772698B2Package structure for integrated circuit deviceMUTUAL PAK TECHNOLOGY CO LTD·Filed 2008·Granted Aug 10, 2010·8 cites·8 claims
- 0577US7943426B2Package structure for integrated circuit device and method of the sameMUTUAL PAK TECHNOLOGY CO LTD·Filed 2009·Granted May 17, 2011·8 cites·18 claims
- 0651US7999191B2Method for making cable with a conductive bump array, and method for connecting the cable to a task objectMUTUAL PAK TECHNOLOGY CO LTD·Filed 2007·Granted Aug 16, 2011·0 cites·10 claims
- 0749US8344500B2Integrated circuit package module and method of the sameMUTUAL PAK TECHNOLOGY CO LTD·Filed 2009·Granted Jan 1, 2013·0 cites·20 claims
- 0849US7698805B2Method for manufacturing integrated circuit device having antenna conductorsMUTUAL PAK TECHNOLOGY CO LTD·Filed 2008·Granted Apr 20, 2010·0 cites·14 claims
- 0946US7312142B2Method for making cable with a conductive bump array, and method for connecting the cable to a task objectMUTUAL PAK TECHNOLOGY CO LTD·Filed 2005·Granted Dec 25, 2007·0 cites·13 claims
- 1044US2015171041A1Chip element and chip packageMUTUAL PAK TECHNOLOGY CO LTD·Filed 2014·Application pending·0 cites
- 1143US2015122892A1Radio frequency identification tagMUTUAL PAK TECHNOLOGY CO LTD·Filed 2014·Application pending·0 cites
- 1242US8344734B2Test module for radio frequency identification chips and method of the sameMUTUAL PAK TECHNOLOGY CO LTD·Filed 2009·Granted Jan 1, 2013·0 cites·6 claims
- 1342US2010267204A1Package structure for integrated circuit device and method of the sameMUTUAL PAK TECHNOLOGY CO LTD·Filed 2010·Application pending·0 cites
- 1440US7413670B2Method for forming wiring on a substrateMUTUAL PAK TECHNOLOGY CO LTD·Filed 2004·Granted Aug 19, 2008·0 cites·5 claims
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